{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T03:11:11Z","timestamp":1767237071138},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,8,1]],"date-time":"2019-08-01T00:00:00Z","timestamp":1564617600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,8,1]],"date-time":"2019-08-01T00:00:00Z","timestamp":1564617600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,8,1]],"date-time":"2019-08-01T00:00:00Z","timestamp":1564617600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,8]]},"DOI":"10.1109\/mwscas.2019.8885179","type":"proceedings-article","created":{"date-parts":[[2019,10,31]],"date-time":"2019-10-31T23:44:38Z","timestamp":1572565478000},"page":"1131-1134","source":"Crossref","is-referenced-by-count":1,"title":["Design Considerations for Insulator Metal Transition based Artificial Neurons"],"prefix":"10.1109","author":[{"given":"Sherif","family":"Amer","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Md Sakib","family":"Hasan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Md","family":"Musabbir Adnan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Garrett S.","family":"Rose","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/DRC.2012.6257012"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.77.195442"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2018.2817604"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1063\/1.3619806"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2967015"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JEDS.2018.2875627"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2016.7838541"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2015.2431914"}],"event":{"name":"2019 IEEE 62nd International Midwest Symposium on Circuits and Systems (MWSCAS)","start":{"date-parts":[[2019,8,4]]},"location":"Dallas, TX, USA","end":{"date-parts":[[2019,8,7]]}},"container-title":["2019 IEEE 62nd International Midwest Symposium on Circuits and Systems (MWSCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8882388\/8884793\/08885179.pdf?arnumber=8885179","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,17]],"date-time":"2022-07-17T21:54:38Z","timestamp":1658094878000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8885179\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,8]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/mwscas.2019.8885179","relation":{},"subject":[],"published":{"date-parts":[[2019,8]]}}}