{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,2]],"date-time":"2025-11-02T05:50:08Z","timestamp":1762062608179,"version":"build-2065373602"},"reference-count":11,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,8,7]],"date-time":"2022-08-07T00:00:00Z","timestamp":1659830400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,8,7]],"date-time":"2022-08-07T00:00:00Z","timestamp":1659830400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012389","name":"National Institute of Information and Communications Technology","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100012389","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,8,7]]},"DOI":"10.1109\/mwscas54063.2022.9859435","type":"proceedings-article","created":{"date-parts":[[2022,8,22]],"date-time":"2022-08-22T20:02:33Z","timestamp":1661198553000},"page":"1-4","source":"Crossref","is-referenced-by-count":4,"title":["A Small-Area Integration of Optical Receiver Using Multi-Layer Inductors and Capacitor-Under-Pad"],"prefix":"10.1109","author":[{"given":"Akira","family":"Tsuchiya","sequence":"first","affiliation":[{"name":"The University of Shiga Prefecture, Hikone-shi,Dept. Electronic Systems Engineering,Shiga,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Toshiyuki","family":"Inoue","sequence":"additional","affiliation":[{"name":"The University of Shiga Prefecture, Hikone-shi,Dept. Electronic Systems Engineering,Shiga,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Keiji","family":"Kishine","sequence":"additional","affiliation":[{"name":"The University of Shiga Prefecture, Hikone-shi,Dept. Electronic Systems Engineering,Shiga,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yasuhiro","family":"Takahashi","sequence":"additional","affiliation":[{"name":"Gifu University,Dept. Electrical, Electronic and Computer Engineering,Gifu-shi, Gifu,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Daisuke","family":"Ito","sequence":"additional","affiliation":[{"name":"Gifu University,Dept. Electrical, Electronic and Computer Engineering,Gifu-shi, Gifu,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Makoto","family":"Nakamura","sequence":"additional","affiliation":[{"name":"Gifu University,Dept. Electrical, Electronic and Computer Engineering,Gifu-shi, Gifu,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IMOC.2013.6646536"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2011.5940640"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2885531"},{"key":"ref6","first-page":"1","article-title":"22.2A 25Gb\/s hybrid integrated silicon photonic transceiver in 28nm CMOS and SOI","author":"chen","year":"2015","journal-title":"IEEE International Solid-State Circuits Conference (ISSCC) Digest of Technical Papers"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2007.373584"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/RFIT49453.2020.9226183"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICEIC54506.2022.9748827"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1587\/transele.2019CTP0008"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2018.2797167"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2886323"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnology18217.2020.9265012"}],"event":{"name":"2022 IEEE 65th International Midwest Symposium on Circuits and Systems (MWSCAS)","start":{"date-parts":[[2022,8,7]]},"location":"Fukuoka, Japan","end":{"date-parts":[[2022,8,10]]}},"container-title":["2022 IEEE 65th International Midwest Symposium on Circuits and Systems (MWSCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9859262\/9859267\/09859435.pdf?arnumber=9859435","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,9,12]],"date-time":"2022-09-12T19:57:36Z","timestamp":1663012656000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9859435\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,8,7]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/mwscas54063.2022.9859435","relation":{},"subject":[],"published":{"date-parts":[[2022,8,7]]}}}