{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,4]],"date-time":"2026-03-04T17:31:49Z","timestamp":1772645509286,"version":"3.50.1"},"reference-count":31,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,8,6]],"date-time":"2023-08-06T00:00:00Z","timestamp":1691280000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,8,6]],"date-time":"2023-08-06T00:00:00Z","timestamp":1691280000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,8,6]]},"DOI":"10.1109\/mwscas57524.2023.10405877","type":"proceedings-article","created":{"date-parts":[[2024,1,31]],"date-time":"2024-01-31T18:29:15Z","timestamp":1706725755000},"page":"98-102","source":"Crossref","is-referenced-by-count":7,"title":["Challenges in Circuits of Nonvolatile Compute-In-Memory for Edge AI Chips"],"prefix":"10.1109","author":[{"given":"Hung-Hsi","family":"Hsu","sequence":"first","affiliation":[{"name":"National Tsing Hua University,Electrical Engineering,Hsinchu,Taiwan"}]},{"given":"Tai-Hao","family":"Wen","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Electrical Engineering,Hsinchu,Taiwan"}]},{"given":"Ping-Chun","family":"Wu","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Electrical Engineering,Hsinchu,Taiwan"}]},{"given":"Chuan-Jia","family":"Jhang","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Electrical Engineering,Hsinchu,Taiwan"}]},{"given":"De-Qi","family":"You","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Electrical Engineering,Hsinchu,Taiwan"}]},{"given":"Ping-Cheng","family":"Chen","sequence":"additional","affiliation":[{"name":"I-Shou University,Kaohsiung,Taiwan"}]},{"given":"Meng-Fan","family":"Chang","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Electrical Engineering,Hsinchu,Taiwan"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731715"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-021-00676-9"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365769"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063078"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662395"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310400"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-020-00505-5"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731679"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731670"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.23919\/VLSICircuits52068.2021.9492362"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-022-04992-8"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-020-1942-4"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062953"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnology18217.2020.9265066"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731725"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365926"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830490"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365939"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731621"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.23919\/VLSICircuits52068.2021.9492347"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830409"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3200515"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067527"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731681"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365984"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062949"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2939682"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731545"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067610"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067563"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/OJSSCS.2021.3123287"}],"event":{"name":"2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS)","location":"Tempe, AZ, USA","start":{"date-parts":[[2023,8,6]]},"end":{"date-parts":[[2023,8,9]]}},"container-title":["2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10405424\/10405847\/10405877.pdf?arnumber=10405877","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,2]],"date-time":"2024-02-02T00:03:05Z","timestamp":1706832185000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10405877\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,8,6]]},"references-count":31,"URL":"https:\/\/doi.org\/10.1109\/mwscas57524.2023.10405877","relation":{},"subject":[],"published":{"date-parts":[[2023,8,6]]}}}