{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,2]],"date-time":"2026-01-02T07:48:06Z","timestamp":1767340086794},"reference-count":25,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,8,6]],"date-time":"2023-08-06T00:00:00Z","timestamp":1691280000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,8,6]],"date-time":"2023-08-06T00:00:00Z","timestamp":1691280000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,8,6]]},"DOI":"10.1109\/mwscas57524.2023.10406141","type":"proceedings-article","created":{"date-parts":[[2024,1,31]],"date-time":"2024-01-31T18:29:15Z","timestamp":1706725755000},"page":"594-598","source":"Crossref","is-referenced-by-count":4,"title":["A Compact and Accurate MOS-based Temperature Sensor for Thermal Management"],"prefix":"10.1109","author":[{"given":"Ruohan","family":"Yang","sequence":"first","affiliation":[{"name":"Iowa State University,Department of Electrical and Computer Engineering,Iowa,USA"}]},{"given":"Bryce","family":"Gadogbe","sequence":"additional","affiliation":[{"name":"Iowa State University,Department of Electrical and Computer Engineering,Iowa,USA"}]},{"given":"Randall L.","family":"Geiger","sequence":"additional","affiliation":[{"name":"Iowa State University,Department of Electrical and Computer Engineering,Iowa,USA"}]},{"given":"Degang","family":"Chen","sequence":"additional","affiliation":[{"name":"Iowa State University,Department of Electrical and Computer Engineering,Iowa,USA"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/mdt.2009.155"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/1283780.1283845"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2007.373608"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310312"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/jsen.2020.3029852"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2012.6176979"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2015.2396522"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/tie.2016.2614273"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2020.2987595"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2019.2921889"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2019.2921889"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2018.2871622"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/jsen.2019.2916809"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062956"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2018.2869595"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/iscas.2015.7168821"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/lssc.2018.2797427"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2021.3137338"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/iscas.2010.5537829"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2015.2476815"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2019.2952855"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2011.2167814"},{"volume-title":"No. 21-C, Section 4.1.4, Release 21","author":"Standard","key":"ref23"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/4.760378"},{"journal-title":"Smart Temperature Sensor Survey","author":"Makinwa","key":"ref25"}],"event":{"name":"2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS)","start":{"date-parts":[[2023,8,6]]},"location":"Tempe, AZ, USA","end":{"date-parts":[[2023,8,9]]}},"container-title":["2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10405424\/10405847\/10406141.pdf?arnumber=10406141","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,2]],"date-time":"2024-02-02T00:12:40Z","timestamp":1706832760000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10406141\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,8,6]]},"references-count":25,"URL":"https:\/\/doi.org\/10.1109\/mwscas57524.2023.10406141","relation":{},"subject":[],"published":{"date-parts":[[2023,8,6]]}}}