{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,22]],"date-time":"2024-10-22T17:39:17Z","timestamp":1729618757932,"version":"3.28.0"},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009]]},"DOI":"10.1109\/nems.2009.5068599","type":"proceedings-article","created":{"date-parts":[[2009,6,10]],"date-time":"2009-06-10T10:54:23Z","timestamp":1244631263000},"page":"376-379","source":"Crossref","is-referenced-by-count":1,"title":["Study on the electrical contact property at the interface of the NiCr\/TiW films"],"prefix":"10.1109","author":[{"given":"Guanggui","family":"Cheng","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Jianning Ding","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Biao Kan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Junziong Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Ningyi Yuan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","first-page":"50","article-title":"pressure contact structure and electrical contact propoerty of integrated power electronic module","volume":"28","author":"he","year":"2008","journal-title":"Proceedings ofthe CSEE"},{"year":"0","key":"2"},{"key":"10","doi-asserted-by":"crossref","first-page":"131901","DOI":"10.1063\/1.2716854","article-title":"annealing kinetics of nanoindentation-induced polycrystalline high pressure phases incrystalline silicon","volume":"90","author":"ruffell","year":"2007","journal-title":"Applied Physics Letters"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2002.800937"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1016\/j.compscitech.2006.12.020"},{"key":"6","first-page":"17","article-title":"preparation and heat treatment analysis of nicr alloy films resistance","author":"qin","year":"2007"},{"year":"0","key":"5"},{"key":"4","first-page":"1059","article-title":"electroless copper and nickel plating on single-crystal silicon for mems applications","volume":"26","author":"han","year":"2005","journal-title":"Chinese Journal of Semiconductors"},{"year":"0","key":"9"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1016\/S0038-1101(99)00020-9"}],"event":{"name":"2009 4th IEEE International Conference on Nano\/Micro Engineered and Molecular Systems","start":{"date-parts":[[2009,1,5]]},"location":"Shenzhen, China","end":{"date-parts":[[2009,1,8]]}},"container-title":["2009 4th IEEE International Conference on Nano\/Micro Engineered and Molecular Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4982489\/5068512\/05068599.pdf?arnumber=5068599","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,18]],"date-time":"2017-06-18T16:53:25Z","timestamp":1497804805000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5068599\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/nems.2009.5068599","relation":{},"subject":[],"published":{"date-parts":[[2009]]}}}