{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T05:47:10Z","timestamp":1729662430781,"version":"3.28.0"},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009]]},"DOI":"10.1109\/nems.2009.5068767","type":"proceedings-article","created":{"date-parts":[[2009,6,10]],"date-time":"2009-06-10T10:54:23Z","timestamp":1244631263000},"page":"1107-1111","source":"Crossref","is-referenced-by-count":0,"title":["Fabrication of complicated three dimensional structures utilizing multi-stack bonding"],"prefix":"10.1109","author":[{"family":"Mingda Zhou","sequence":"first","affiliation":[]},{"family":"Yilong Hao","sequence":"additional","affiliation":[]},{"family":"Chengchen Gao","sequence":"additional","affiliation":[]},{"family":"Zhihong Li","sequence":"additional","affiliation":[]},{"family":"Qifang Hu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"crossref","first-page":"194","DOI":"10.1016\/S0924-4247(02)00332-1","article-title":"multi-stack silicon-direct wafer bonding for 3d mems manufacturing","volume":"103","author":"miki","year":"2003","journal-title":"Sensors and Actuators A"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/84.896774"},{"key":"1","article-title":"demonstration of a microfabricated high-speed turbine supported on gas bearings","author":"frenchette","year":"2000","journal-title":"Proceedings of the Hilton Head Solid-state Sensors and Actuators Workshop"},{"key":"7","first-page":"390","volume":"24","author":"chen","year":"2004","journal-title":"Interface of Si\/ Si Directly Wafer Bonding"},{"key":"6","doi-asserted-by":"crossref","first-page":"161","DOI":"10.1016\/S0924-4247(98)00310-0","article-title":"wafer bonding for microsystem technologies","volume":"74","author":"gosele","year":"1999","journal-title":"Sensors and Actuators A"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/16\/10\/006"},{"key":"4","doi-asserted-by":"crossref","first-page":"522","DOI":"10.1016\/S0167-9317(02)00938-3","article-title":"electrical properties of si\/si02\/si structures produced by direct boding of pre-oxidized silicon wafers","volume":"66","author":"fedotov","year":"2003","journal-title":"Microelectronic Engineering"}],"event":{"name":"2009 4th IEEE International Conference on Nano\/Micro Engineered and Molecular Systems","start":{"date-parts":[[2009,1,5]]},"location":"Shenzhen, China","end":{"date-parts":[[2009,1,8]]}},"container-title":["2009 4th IEEE International Conference on Nano\/Micro Engineered and Molecular Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4982489\/5068512\/05068767.pdf?arnumber=5068767","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,18]],"date-time":"2017-06-18T16:53:21Z","timestamp":1497804801000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5068767\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/nems.2009.5068767","relation":{},"subject":[],"published":{"date-parts":[[2009]]}}}