{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,8]],"date-time":"2025-11-08T17:34:45Z","timestamp":1762623285345,"version":"3.28.0"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010,1]]},"DOI":"10.1109\/nems.2010.5592452","type":"proceedings-article","created":{"date-parts":[[2010,10,1]],"date-time":"2010-10-01T16:09:54Z","timestamp":1285949394000},"page":"524-527","source":"Crossref","is-referenced-by-count":3,"title":["Stress in Si-glass anodic bonding and its effect on silicon piezoresistive pressure sensor"],"prefix":"10.1109","author":[{"family":"Xiaoshan Zheng","sequence":"first","affiliation":[]},{"family":"Wenshan Chen","sequence":"additional","affiliation":[]},{"family":"Xuyuan Chen","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"crossref","first-page":"165","DOI":"10.1016\/j.sna.2008.10.012","article-title":"A novel plastic package for pressure sensors fabricated using the lithographic dam-ring approach","volume":"149","author":"lung-tai","year":"2009","journal-title":"Sensors and Actuators A Physical"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"29","DOI":"10.1016\/j.sna.2009.03.007","article-title":"Sensitivity analysis of packaging effect of silicon-based piezoresistive pressure sensor","volume":"152","author":"tsung-lin","year":"2009","journal-title":"Sensors and Actuators A Physical"},{"key":"ref6","article-title":"Residua stress in absolute pressure sensor using Si-Glass anodic bonding","volume":"14","author":"dong-hua","year":"2008","journal-title":"Journal of funcantion tateirals and devices"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1149\/1.1836652"},{"year":"0","key":"ref8"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRev.94.42"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2004.05.020"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/13\/2\/308"}],"event":{"name":"2010 5th IEEE International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS 2010)","start":{"date-parts":[[2010,1,20]]},"location":"Xiamen","end":{"date-parts":[[2010,1,23]]}},"container-title":["2010 IEEE 5th International Conference on Nano\/Micro Engineered and Molecular Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5583931\/5592106\/05592452.pdf?arnumber=5592452","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,19]],"date-time":"2017-06-19T10:42:19Z","timestamp":1497868939000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5592452\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,1]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/nems.2010.5592452","relation":{},"subject":[],"published":{"date-parts":[[2010,1]]}}}