{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T18:56:09Z","timestamp":1725389769615},"reference-count":12,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,4]]},"DOI":"10.1109\/nems.2013.6559703","type":"proceedings-article","created":{"date-parts":[[2013,7,25]],"date-time":"2013-07-25T19:29:19Z","timestamp":1374780559000},"page":"155-158","source":"Crossref","is-referenced-by-count":0,"title":["Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration"],"prefix":"10.1109","author":[{"family":"Zhiyuan Zhu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Shaonan Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Yichao Xu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Guanjiang Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Yudan Pi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Peiquan Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Yunhui Zhu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Xin Sun","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Min Yu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Jing Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Min Miao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Yufeng Jin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/JSTQE.2010.2093570"},{"key":"2","article-title":"More-than-Moore white paper","author":"wolfgang","year":"2011","journal-title":"The International Technology Roadmap for Semiconductors"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/NEMS.2011.6017432"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2001.979465"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2008.01.054"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2008.2000274"},{"key":"5","first-page":"487","article-title":"Heterogeneous integration for optical mems","author":"fischer","year":"2012","journal-title":"23rd Annual Meeting of the IEEE Photonics Society"},{"key":"4","first-page":"11801183","article-title":"GaAs\/si metal wafer bonding for heterogeneous integrated circuits","author":"bickford","year":"2008","journal-title":"Int Solid-State Integr Circuit Technol Conf"},{"key":"9","first-page":"126","article-title":"MEMS Packaging Technologies & Applications","author":"chang","year":"2010","journal-title":"International Symposium on VLSI Design Automation and Test"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.2008.4443780"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1117\/12.642672"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1149\/1.3592267"}],"event":{"name":"2013 8th IEEE International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)","start":{"date-parts":[[2013,4,7]]},"location":"Suzhou, China","end":{"date-parts":[[2013,4,10]]}},"container-title":["The 8th Annual IEEE International Conference on Nano\/Micro Engineered and Molecular Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6556708\/6559668\/06559703.pdf?arnumber=6559703","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T21:32:00Z","timestamp":1490218320000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6559703\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,4]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/nems.2013.6559703","relation":{},"subject":[],"published":{"date-parts":[[2013,4]]}}}