{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T09:34:58Z","timestamp":1725442498252},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,4]]},"DOI":"10.1109\/nems.2013.6559724","type":"proceedings-article","created":{"date-parts":[[2013,7,25]],"date-time":"2013-07-25T15:29:19Z","timestamp":1374766159000},"page":"244-247","source":"Crossref","is-referenced-by-count":0,"title":["Sn-rich Au-Sn hermetic packaging at wafer level and its application in SPR sensor"],"prefix":"10.1109","author":[{"family":"Xu Mao","sequence":"first","affiliation":[]},{"family":"Zhiqiang Fang","sequence":"additional","affiliation":[]},{"family":"Zhe Zhang","sequence":"additional","affiliation":[]},{"family":"Jinling Yang","sequence":"additional","affiliation":[]},{"family":"Zhimei Qi","sequence":"additional","affiliation":[]},{"family":"Fuhua Yang","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2003.815109"},{"key":"2","first-page":"278","author":"okamoto","year":"1987","journal-title":"Phase Diagram of Binary Gold Alloys ASM International"},{"key":"1","first-page":"377","article-title":"The role of au\/sn solder in packaging","author":"oppermann","year":"2006","journal-title":"Materials for Information Technology Devices Interconnects and Packaging"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1021\/cr068107d"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1016\/j.msea.2004.11.022"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1016\/0040-6090(93)90533-U"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2008.922000"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1557\/JMR.2005.0269"}],"event":{"name":"2013 8th IEEE International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)","start":{"date-parts":[[2013,4,7]]},"location":"Suzhou, China","end":{"date-parts":[[2013,4,10]]}},"container-title":["The 8th Annual IEEE International Conference on Nano\/Micro Engineered and Molecular Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6556708\/6559668\/06559724.pdf?arnumber=6559724","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T14:38:43Z","timestamp":1490193523000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6559724\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,4]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/nems.2013.6559724","relation":{},"subject":[],"published":{"date-parts":[[2013,4]]}}}