{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,22]],"date-time":"2024-10-22T17:04:01Z","timestamp":1729616641318,"version":"3.28.0"},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,4]]},"DOI":"10.1109\/nems.2015.7147491","type":"proceedings-article","created":{"date-parts":[[2015,7,7]],"date-time":"2015-07-07T21:44:38Z","timestamp":1436305478000},"page":"557-560","source":"Crossref","is-referenced-by-count":0,"title":["Realization of the microchannel with microisland arrays by one-step silicon wet etching process"],"prefix":"10.1109","author":[{"family":"Yifan Wang","sequence":"first","affiliation":[]},{"family":"Zewen Liu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1149\/1.2086277"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/0924-4247(93)80123-X"},{"key":"ref12","first-page":"97","article-title":"A model explaining mask-corner undercut phenomena in anisotropic silicon etching: a saddle point in the etching-rate diagram","volume":"758 763","author":"shikida","year":"2002","journal-title":"Sens Actuator A-Phys"},{"key":"ref13","doi-asserted-by":"crossref","first-page":"192","DOI":"10.1016\/j.sna.2008.09.002","article-title":"Study of corner compensating structures and fabrication of various shapes of MEMS structures in pure and surfactant added TMAH","volume":"154","author":"pal","year":"2009","journal-title":"Sens Actuator A-Phys"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1177\/2041297510393784"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1146\/annurev.fluid.36.050802.122124"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1021\/ac800680j"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.3390\/s7091901"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/15\/8\/014"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/17\/10\/R01"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/19\/10\/105005"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.3390\/s140712370"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.pbiomolbio.2013.10.002"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1149\/1.2086334"}],"event":{"name":"2015 IEEE 10th International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)","start":{"date-parts":[[2015,4,7]]},"location":"Xi'an, China","end":{"date-parts":[[2015,4,11]]}},"container-title":["10th IEEE International Conference on Nano\/Micro Engineered and Molecular Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7132046\/7147342\/07147491.pdf?arnumber=7147491","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,23]],"date-time":"2017-06-23T15:17:19Z","timestamp":1498231039000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7147491\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,4]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/nems.2015.7147491","relation":{},"subject":[],"published":{"date-parts":[[2015,4]]}}}