{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T03:25:04Z","timestamp":1729653904622,"version":"3.28.0"},"reference-count":12,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,4]]},"DOI":"10.1109\/nems.2016.7758207","type":"proceedings-article","created":{"date-parts":[[2016,12,19]],"date-time":"2016-12-19T21:10:20Z","timestamp":1482181820000},"page":"91-94","source":"Crossref","is-referenced-by-count":0,"title":["Fabrication and characterization of fine pitch TSV integration with self-aligned backside insulation layer opening"],"prefix":"10.1109","author":[{"given":"Yong","family":"Guan","sequence":"first","affiliation":[]},{"given":"Qinghua","family":"Zeng","sequence":"additional","affiliation":[]},{"given":"Jing","family":"Chen","sequence":"additional","affiliation":[]},{"given":"Shenglin","family":"Ma","sequence":"additional","affiliation":[]},{"given":"Yufeng","family":"Jin","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2011.2125791"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2011.6131504"},{"key":"ref10","first-page":"306","article-title":"5 Minutes TSV copper electrodeposition","author":"kondo","year":"2014","journal-title":"2014 9th International Microsystems Packaging Assembly and Circuits Technology Conference Conf"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2015.7159686"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1147\/JRD.2008.5388567"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2010.2084068"},{"key":"ref12","doi-asserted-by":"crossref","first-page":"145","DOI":"10.1016\/j.mee.2015.10.010","article-title":"Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration","volume":"149","author":"sun","year":"2015","journal-title":"Elsevier Microelectronic Engineering"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1108\/13565361111127304"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ASMC.2012.6212888"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1147\/JRD.2008.5388564"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.electacta.2010.07.045"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2015.7159686"}],"event":{"name":"2016 IEEE 11th Annual International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)","start":{"date-parts":[[2016,4,17]]},"location":"Sendai, Japan","end":{"date-parts":[[2016,4,20]]}},"container-title":["2016 IEEE 11th Annual International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7750493\/7758182\/07758207.pdf?arnumber=7758207","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,25]],"date-time":"2017-06-25T06:16:54Z","timestamp":1498371414000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7758207\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,4]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/nems.2016.7758207","relation":{},"subject":[],"published":{"date-parts":[[2016,4]]}}}