{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,6]],"date-time":"2025-10-06T18:26:09Z","timestamp":1759775169602},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,4]]},"DOI":"10.1109\/nems.2016.7758317","type":"proceedings-article","created":{"date-parts":[[2016,12,19]],"date-time":"2016-12-19T21:10:20Z","timestamp":1482181820000},"page":"573-577","source":"Crossref","is-referenced-by-count":1,"title":["Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps"],"prefix":"10.1109","author":[{"given":"Muhammad Salman","family":"Al Farisi","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hideki","family":"Hirano","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shuji","family":"Tanaka","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2014.02.001"},{"key":"ref3","article-title":"Metal based wafer level packaging","author":"farrens","year":"2008","journal-title":"Global SMT & Packaging"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TRANSDUCERS.2015.7181165"},{"key":"ref5","first-page":"944","article-title":"20-um-pitch Au micro-bump interconnection at room temperature in ambient air","author":"wang","year":"0"},{"journal-title":"Theory of Plates and Shells","year":"1987","author":"timoshenko","key":"ref7"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/22\/10\/105025"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/18\/7\/073001"}],"event":{"name":"2016 IEEE 11th Annual International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)","start":{"date-parts":[[2016,4,17]]},"location":"Sendai, Japan","end":{"date-parts":[[2016,4,20]]}},"container-title":["2016 IEEE 11th Annual International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7750493\/7758182\/07758317.pdf?arnumber=7758317","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2016,12,20]],"date-time":"2016-12-20T03:39:02Z","timestamp":1482205142000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7758317\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,4]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/nems.2016.7758317","relation":{},"subject":[],"published":{"date-parts":[[2016,4]]}}}