{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T10:42:09Z","timestamp":1730284929487,"version":"3.28.0"},"reference-count":12,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,4]]},"DOI":"10.1109\/nems.2018.8557002","type":"proceedings-article","created":{"date-parts":[[2018,12,13]],"date-time":"2018-12-13T01:00:02Z","timestamp":1544662802000},"page":"456-459","source":"Crossref","is-referenced-by-count":3,"title":["Annular-Encapsulation Packaging to Realize High-Performance MEMS Thermal Wind Sensor"],"prefix":"10.1109","author":[{"given":"Yizhou","family":"Ye","sequence":"first","affiliation":[]},{"given":"Zhenjun","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Zhenxiang","family":"Yi","sequence":"additional","affiliation":[]},{"given":"Ming","family":"Qin","sequence":"additional","affiliation":[]},{"given":"Qing-An","family":"Huang","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2003.820261"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"312","DOI":"10.1016\/j.sna.2003.12.019","article-title":"Measurement of flow direction and velocity using a micromachined flow sensor","volume":"114","author":"kim","year":"2004","journal-title":"Sens Actuators A Phys"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2017.2707558"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2006.888599"},{"journal-title":"Comsol","year":"2015","key":"ref11"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2010.08.012"},{"key":"ref12","doi-asserted-by":"crossref","first-page":"18","DOI":"10.1016\/j.sna.2007.12.010","article-title":"A biocompatible parylene thermal flow sensing array","volume":"144","author":"meng","year":"2008","journal-title":"Sens Actuators A Phys"},{"key":"ref8","first-page":"879","article-title":"A self-packaged thermal flow sensor by CMOS MEMS technology","author":"gao","year":"0","journal-title":"Proc 3rd IEEE Conf Sensors"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2011.2179014"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.3390\/mi3030550"},{"key":"ref9","first-page":"202","author":"holman","year":"2007","journal-title":"Heat Transfer"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/S0955-5986(97)00019-8"}],"event":{"name":"2018 IEEE 13th Annual International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)","start":{"date-parts":[[2018,4,22]]},"location":"Singapore","end":{"date-parts":[[2018,4,26]]}},"container-title":["2018 IEEE 13th Annual International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8540837\/8556858\/08557002.pdf?arnumber=8557002","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,11,11]],"date-time":"2021-11-11T00:12:27Z","timestamp":1636589547000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8557002\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,4]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/nems.2018.8557002","relation":{},"subject":[],"published":{"date-parts":[[2018,4]]}}}