{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T08:44:13Z","timestamp":1725612253630},"reference-count":18,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,4]]},"DOI":"10.1109\/nems.2018.8557015","type":"proceedings-article","created":{"date-parts":[[2018,12,13]],"date-time":"2018-12-13T01:00:02Z","timestamp":1544662802000},"page":"212-215","source":"Crossref","is-referenced-by-count":1,"title":["High Quality Factor PMUTs with Optimized Thermo-Elastic Dissipation through Etching Holes"],"prefix":"10.1109","author":[{"given":"Xuying","family":"Chen","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xinxin","family":"Liu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tao","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xianhao","family":"Le","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhonggui","family":"Xu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chengkuo","family":"Lee","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jin","family":"Xie","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/21\/8\/085021"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRev.52.230"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRev.53.90"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.2017.7863582"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.2017.7863613"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.61.5600"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TUFFC.2005.1563270"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2014.2387154"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TRANSDUCERS.2011.5969223"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2015.2503336"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757403"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1063\/1.4905441"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1023\/B:JECR.0000034004.99355.8b"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1063\/1.4922915"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2364975"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.2014.6765748"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ndteint.2006.03.006"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2016.04.006"}],"event":{"name":"2018 IEEE 13th Annual International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)","start":{"date-parts":[[2018,4,22]]},"location":"Singapore","end":{"date-parts":[[2018,4,26]]}},"container-title":["2018 IEEE 13th Annual International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8540837\/8556858\/08557015.pdf?arnumber=8557015","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,11,11]],"date-time":"2021-11-11T00:12:53Z","timestamp":1636589573000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8557015\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,4]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/nems.2018.8557015","relation":{},"subject":[],"published":{"date-parts":[[2018,4]]}}}