{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,25]],"date-time":"2026-01-25T01:39:29Z","timestamp":1769305169812,"version":"3.49.0"},"reference-count":22,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,4,25]],"date-time":"2021-04-25T00:00:00Z","timestamp":1619308800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,4,25]],"date-time":"2021-04-25T00:00:00Z","timestamp":1619308800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,4,25]],"date-time":"2021-04-25T00:00:00Z","timestamp":1619308800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2019YFB2005702,2018YFB2003001"],"award-info":[{"award-number":["2019YFB2005702,2018YFB2003001"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,4,25]]},"DOI":"10.1109\/nems51815.2021.9451313","type":"proceedings-article","created":{"date-parts":[[2021,6,21]],"date-time":"2021-06-21T21:11:44Z","timestamp":1624309904000},"page":"51-54","source":"Crossref","is-referenced-by-count":1,"title":["Efficient Infrared-Thermal-Electric Conversion with Textured Dielectric Film"],"prefix":"10.1109","author":[{"given":"Yunqian","family":"He","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuelin","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tie","family":"Li","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2020.2971017"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2019.2891436"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2019.2948645"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2017.2757402"},{"key":"ref14","first-page":"2310","article-title":"Temperature Error Analysis and Parameter Extraction of an 8-14-mu m Thermopile With a Wavelength-Independent Absorber for Tympanic Thermometer","volume":"11","author":"chen","year":"2011","journal-title":"IEEE Sensors Journal"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/20\/11\/115004"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2010.2086429"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2019.2896668"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1063\/1.4921170"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1117\/1.OE.52.12.127104"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.snb.2016.04.016"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/LPT.2010.2095455"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.snb.2016.03.040"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.snb.2019.03.017"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2020.2968090"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1364\/OL.44.004111"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1007\/s11465-017-0441-2"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1088\/0957-0233\/18\/7\/R01"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/84.967372"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1063\/1.3673856"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2004.11.027"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/T-ED.1986.22689"}],"event":{"name":"2021 IEEE 16th International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)","location":"Xiamen, China","start":{"date-parts":[[2021,4,25]]},"end":{"date-parts":[[2021,4,29]]}},"container-title":["2021 IEEE 16th International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9451202\/9451223\/09451313.pdf?arnumber=9451313","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T15:42:33Z","timestamp":1652197353000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9451313\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,4,25]]},"references-count":22,"URL":"https:\/\/doi.org\/10.1109\/nems51815.2021.9451313","relation":{},"subject":[],"published":{"date-parts":[[2021,4,25]]}}}