{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T01:08:02Z","timestamp":1740100082781,"version":"3.37.3"},"reference-count":18,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,4,25]],"date-time":"2021-04-25T00:00:00Z","timestamp":1619308800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,4,25]],"date-time":"2021-04-25T00:00:00Z","timestamp":1619308800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,4,25]],"date-time":"2021-04-25T00:00:00Z","timestamp":1619308800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2018YFB2002302"],"award-info":[{"award-number":["2018YFB2002302"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,4,25]]},"DOI":"10.1109\/nems51815.2021.9451332","type":"proceedings-article","created":{"date-parts":[[2021,6,21]],"date-time":"2021-06-21T21:11:44Z","timestamp":1624309904000},"page":"1691-1694","source":"Crossref","is-referenced-by-count":0,"title":["A Resonant Differential Pressure Microsensor With a Stress Isolation Layer"],"prefix":"10.1109","author":[{"given":"Yadong","family":"Li","sequence":"first","affiliation":[]},{"given":"Chao","family":"Cheng","sequence":"additional","affiliation":[]},{"given":"Yulan","family":"Lu","sequence":"additional","affiliation":[]},{"given":"Jian","family":"Chen","sequence":"additional","affiliation":[]},{"given":"Junbo","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Deyong","family":"Chen","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2010.2101230"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2012.2215009"},{"key":"ref12","first-page":"1","article-title":"Design and Verification of a Structure for Isolating Packaging Stress in SOI MEMS Devices","volume":"pp","author":"hao","year":"2016","journal-title":"IEEE Sens J"},{"key":"ref13","doi-asserted-by":"crossref","first-page":"896","DOI":"10.4028\/www.scientific.net\/MSF.694.896","article-title":"Vacuum Adhesive Bonding and Stress Isolation for MEMS Resonant Pressure Sensor Package","volume":"694","author":"yuxin","year":"2011","journal-title":"MSF"},{"key":"ref14","article-title":"An Improved Metal-Packaged Strain Sensor Based on A Regenerated Fiber Bragg Grating in Hydrogen-Loaded Boron-Germanium Co-Doped Photosensitive Fiber for High-Temperature Applications","volume":"17","author":"yun","year":"2017","journal-title":"Sensors (Basel Switzerland)"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/0924-4247(95)00997-3"},{"journal-title":"Miniature Silicon Resonant Pressure Sensor","year":"1988","author":"greenwood","key":"ref16"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/0924-4247(90)85028-3"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.2013.6474172"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(99)00065-5"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IECON.1992.254354"},{"key":"ref6","doi-asserted-by":"crossref","first-page":"148","DOI":"10.3390\/mi7090148","article-title":"Design and Analysis of a New Tuning Fork Structure for Resonant Pressure Sensor","volume":"7","author":"xiaodong","year":"2016","journal-title":"Micromachines"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.3390\/s141224244"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2013.2253158"},{"key":"ref7","doi-asserted-by":"crossref","first-page":"599","DOI":"10.3390\/s17030599","article-title":"High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor","volume":"17","author":"liying","year":"2017","journal-title":"SENSORS"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(98)00245-3"},{"key":"ref1","first-page":"187","article-title":"Actuality and development of the differential pressure sensor technology","volume":"41","author":"hu","year":"2013","journal-title":"Machine Tool & Hydraulics"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/SENSOR.1991.149056"}],"event":{"name":"2021 IEEE 16th International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)","start":{"date-parts":[[2021,4,25]]},"location":"Xiamen, China","end":{"date-parts":[[2021,4,29]]}},"container-title":["2021 IEEE 16th International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9451202\/9451223\/09451332.pdf?arnumber=9451332","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T15:42:33Z","timestamp":1652197353000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9451332\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,4,25]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/nems51815.2021.9451332","relation":{},"subject":[],"published":{"date-parts":[[2021,4,25]]}}}