{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T10:44:01Z","timestamp":1730285041410,"version":"3.28.0"},"reference-count":18,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,4,25]],"date-time":"2021-04-25T00:00:00Z","timestamp":1619308800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,4,25]],"date-time":"2021-04-25T00:00:00Z","timestamp":1619308800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,4,25]],"date-time":"2021-04-25T00:00:00Z","timestamp":1619308800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,4,25]]},"DOI":"10.1109\/nems51815.2021.9451393","type":"proceedings-article","created":{"date-parts":[[2021,6,21]],"date-time":"2021-06-21T21:11:44Z","timestamp":1624309904000},"page":"1871-1876","source":"Crossref","is-referenced-by-count":1,"title":["Development of an Annular-Shaped Bernoulli Gripper for Contactless Gripping of Large-Size Silicon Wafer"],"prefix":"10.1109","author":[{"given":"Shihang","family":"Wang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yancheng","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Deqing","family":"Mei","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Songqiao","family":"Dai","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.precisioneng.2018.01.006"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1108\/AA-09-2012-075"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2018.2848635"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1115\/1.3139222"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1007\/s12541-015-0270-3"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.cirp.2009.03.076"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/AIM.2017.8014028"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1115\/1.4007186"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.expthermflusci.2016.03.024"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.solmat.2009.01.016"},{"key":"ref3","first-page":"1165","article-title":"Advanced production challenges for automated ultra-thin wafer handling","author":"giesen","year":"2012","journal-title":"Proceeding 27th European Photovoltaic Solar Energy Conf and Exhibition"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/SMC.2019.8914479"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2013.2261034"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/s12650-010-0045-y"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1108\/01439910310479630"},{"journal-title":"International Roadmap for Devices and Systems (IRDS&#x2122;-2017)","year":"0","key":"ref2"},{"journal-title":"Semiconductor Industry Association Washington DC USA Version 2 0","article-title":"International Technology Roadmap for Semiconductors Reports (ITRS-2015)","year":"0","key":"ref1"},{"key":"ref9","first-page":"639","article-title":"Development of a Pneumatic Sucker for Gripping Workpieces with Rough Surface","volume":"13","author":"lin","year":"2014","journal-title":"IEEE Tran Autom Sci Eng"}],"event":{"name":"2021 IEEE 16th International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)","start":{"date-parts":[[2021,4,25]]},"location":"Xiamen, China","end":{"date-parts":[[2021,4,29]]}},"container-title":["2021 IEEE 16th International Conference on Nano\/Micro Engineered and Molecular Systems (NEMS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9451202\/9451223\/09451393.pdf?arnumber=9451393","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T15:42:34Z","timestamp":1652197354000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9451393\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,4,25]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/nems51815.2021.9451393","relation":{},"subject":[],"published":{"date-parts":[[2021,4,25]]}}}