{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T20:11:21Z","timestamp":1725480681982},"reference-count":11,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,6]]},"DOI":"10.1109\/newcas.2013.6573575","type":"proceedings-article","created":{"date-parts":[[2013,8,14]],"date-time":"2013-08-14T16:20:36Z","timestamp":1376497236000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Designing 3D tree-based FPGA: Interconnect optimization and thermal analysis"],"prefix":"10.1109","author":[{"given":"Vinod","family":"Pangracious","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Habib","family":"Mehrez","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zied","family":"Marakchi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/92.902261"},{"journal-title":"ITRS International Technology Roadmap for Semiconductors","year":"2012","key":"2"},{"key":"10","first-page":"90","author":"ayala","year":"2009","journal-title":"Through Silicon Via-Based Grid for Thermal Control in 3D Chips NanoNet"},{"journal-title":"Reconfigurable Architectures for General-Purpose Computing","year":"1996","author":"dehon","key":"1"},{"key":"7","doi-asserted-by":"crossref","DOI":"10.1155\/2008\/764942","article-title":"Architecture level exploration of alternative schmes targeting 3d fpgas: A software supported methodology","author":"siozios","year":"2008","journal-title":"International Journal of Reconfigurable Computing"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1155\/2009\/259837"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-36812-7_19"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1145\/1572471.1572486"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2005.78"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.150"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2007.373897"}],"event":{"name":"2013 IEEE 11th International New Circuits and Systems Conference (NEWCAS)","start":{"date-parts":[[2013,6,16]]},"location":"Paris, France","end":{"date-parts":[[2013,6,19]]}},"container-title":["2013 IEEE 11th International New Circuits and Systems Conference (NEWCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6568396\/6573561\/06573575.pdf?arnumber=6573575","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,21]],"date-time":"2017-06-21T17:50:29Z","timestamp":1498067429000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6573575\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,6]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/newcas.2013.6573575","relation":{},"subject":[],"published":{"date-parts":[[2013,6]]}}}