{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,3,27]],"date-time":"2025-03-27T08:22:47Z","timestamp":1743063767184},"reference-count":12,"publisher":"IEEE","license":[{"start":{"date-parts":[[2013,6,1]],"date-time":"2013-06-01T00:00:00Z","timestamp":1370044800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2013,6,1]],"date-time":"2013-06-01T00:00:00Z","timestamp":1370044800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,6]]},"DOI":"10.1109\/newcas.2013.6573611","type":"proceedings-article","created":{"date-parts":[[2013,8,14]],"date-time":"2013-08-14T16:20:36Z","timestamp":1376497236000},"page":"1-4","source":"Crossref","is-referenced-by-count":20,"title":["A 3D IC BIST for pre-bond test of TSVs using ring oscillators"],"prefix":"10.1109","author":[{"given":"Yassine","family":"Fkih","sequence":"first","affiliation":[{"name":"CEA-Leti, MINATEC Campus, F38054, Grenoble, France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Pascal","family":"Vivet","sequence":"additional","affiliation":[{"name":"CEA-Leti, MINATEC Campus, F38054, Grenoble, France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bruno","family":"Rouzeyre","sequence":"additional","affiliation":[{"name":"LIRMM - Université Montpellier II\/CNRS Montpellier, France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Marie-lise","family":"Flottes","sequence":"additional","affiliation":[{"name":"LIRMM - Université Montpellier II\/CNRS Montpellier, France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Giorgio","family":"Di Natale","sequence":"additional","affiliation":[{"name":"LIRMM - Université Montpellier II\/CNRS Montpellier, France"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"IEEE Standard Test Access Port and Boundary-Scan Architecture","year":"0","key":"3"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2009.5355573"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.225"},{"journal-title":"WideIO JEDEC Standard","year":"0","key":"1"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-011-5261-4"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2011.6139179"},{"journal-title":"IEEE 3D-Test Working Group (3DT-WG)","year":"0","key":"5"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2010.5469556"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306569"},{"key":"8","article-title":"On-chip tsv testing for 3d ic before bonding using sense amplification","author":"chen","year":"2009","journal-title":"Proc ATS"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2012.6248903"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/FPL.2011.15"}],"event":{"name":"2013 IEEE 11th International New Circuits and Systems Conference (NEWCAS)","start":{"date-parts":[[2013,6,16]]},"location":"Paris, France","end":{"date-parts":[[2013,6,19]]}},"container-title":["2013 IEEE 11th International New Circuits and Systems Conference (NEWCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6568396\/6573561\/06573611.pdf?arnumber=6573611","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,4,14]],"date-time":"2023-04-14T17:25:23Z","timestamp":1681493123000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/6573611\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,6]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/newcas.2013.6573611","relation":{},"subject":[],"published":{"date-parts":[[2013,6]]}}}