{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T20:32:04Z","timestamp":1725741124848},"reference-count":27,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,6,19]],"date-time":"2022-06-19T00:00:00Z","timestamp":1655596800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,6,19]],"date-time":"2022-06-19T00:00:00Z","timestamp":1655596800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,6,19]]},"DOI":"10.1109\/newcas52662.2022.9842234","type":"proceedings-article","created":{"date-parts":[[2022,8,5]],"date-time":"2022-08-05T19:33:34Z","timestamp":1659728014000},"page":"188-192","source":"Crossref","is-referenced-by-count":1,"title":["A Reconfigurable Power System-in-Package Module using GaN HEMTs and IC Bare Dies on LTCC Substrate: Design - Implementation - Experiment and Future Directions"],"prefix":"10.1109","author":[{"given":"Van Ha","family":"Nguyen","sequence":"first","affiliation":[{"name":"University of Québec,École de Technologie Supérieure,Department of Electrical Engineering,Montréal,Qu\u00e9bec,Canada"}]},{"given":"Nueraimaiti","family":"Aimaier","sequence":"additional","affiliation":[{"name":"Concordia University,Department of Electrical and Computer Engineering,Montreal,Quebec,Canada"}]},{"given":"Gabriel","family":"Nobert","sequence":"additional","affiliation":[{"name":"University of Québec,École de Technologie Supérieure,Department of Electrical Engineering,Montréal,Qu\u00e9bec,Canada"}]},{"given":"Tan","family":"Pham","sequence":"additional","affiliation":[{"name":"University of Québec,École de Technologie Supérieure,Department of Electrical Engineering,Montréal,Qu\u00e9bec,Canada"}]},{"given":"Nicolas","family":"Constantin","sequence":"additional","affiliation":[{"name":"University of Québec,École de Technologie Supérieure,Department of Electrical Engineering,Montréal,Qu\u00e9bec,Canada"}]},{"given":"Yves","family":"Blaquiere","sequence":"additional","affiliation":[{"name":"University of Québec,École de Technologie Supérieure,Department of Electrical Engineering,Montréal,Qu\u00e9bec,Canada"}]},{"given":"Glenn","family":"Cowan","sequence":"additional","affiliation":[{"name":"Concordia University,Department of Electrical and Computer Engineering,Montreal,Quebec,Canada"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.24295\/CPSSTPEA.2017.00027"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/NEMS.2011.6017474"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2009.4802953"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2010.5433519"},{"article-title":"Low Temperature Co-Fired Ceramic Systems - A6M-E High Frequency LTCC Tape System","year":"2015","author":"ferro","key":"ref14"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2010.2046913"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC48849.2020.9229808"},{"article-title":"4.5V to 60V, 3A High-Efficiency, DC-DC StepDown SiP Power Module with Integrated Inductor","year":"2019","author":"inregrated","key":"ref17"},{"article-title":"TPS82084 (2-A) \/ TPS82085 (3-A) High Efficiency Step-Down Converter MicroSiP™ Modules with Integrated Inductor","year":"2019","author":"instrument","key":"ref18"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2017.2657579"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2016.7573394"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS51556.2021.9401689"},{"journal-title":"Heterogeneous Integration Roadmap","article-title":"Integrated Power Electronics","year":"2019","key":"ref3"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/3DPEIM.2016.7570574"},{"key":"ref5","first-page":"1365","article-title":"High Power-Density 3D Integrated Power Supply Module Based on PanelLevel PCB Embedded Technology","author":"hou","year":"2018","journal-title":"Proc IEEE 68th Electronic Components and Technology Conference (ECTC)"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-7276-7_14"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/3DPEIM.2018.8525236"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2227821"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/CSTIC.2019.8755666"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MCAS.2002.1173132"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2019.2897537"},{"key":"ref22","first-page":"178","article-title":"A high voltage multi-purpose on-the-fly reconfigurable half-bridge gate driver for GaN HEMTs in 0.18-?m HV SOI CMOS technology","author":"ly","year":"2020","journal-title":"Proc 18th IEEE Int New Circuits Syst Conf (NEWCAS)"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2018.8340990"},{"key":"ref24","article-title":"A MEMS Electrothermal Actuator Designed for a DC Switch Aimed at Power Switching Applications and High Voltage Resilience","author":"hassan shuaibu","year":"2022","journal-title":"Proc 20th IEEE Int New Circuits Syst Conf (NEWCAS)"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3066980"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS51556.2021.9401066"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ICECS.2018.8617972"}],"event":{"name":"2022 20th IEEE Interregional NEWCAS Conference (NEWCAS)","start":{"date-parts":[[2022,6,19]]},"location":"Quebec City, QC, Canada","end":{"date-parts":[[2022,6,22]]}},"container-title":["2022 20th IEEE Interregional NEWCAS Conference (NEWCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9841660\/9841947\/09842234.pdf?arnumber=9842234","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,8,16]],"date-time":"2022-08-16T03:03:45Z","timestamp":1660619025000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9842234\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,6,19]]},"references-count":27,"URL":"https:\/\/doi.org\/10.1109\/newcas52662.2022.9842234","relation":{},"subject":[],"published":{"date-parts":[[2022,6,19]]}}}