{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,29]],"date-time":"2025-09-29T15:48:04Z","timestamp":1759160884069,"version":"3.28.0"},"reference-count":34,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,10]]},"DOI":"10.1109\/nocs.2018.8512167","type":"proceedings-article","created":{"date-parts":[[2018,10,30]],"date-time":"2018-10-30T10:00:44Z","timestamp":1540893644000},"page":"1-8","source":"Crossref","is-referenced-by-count":6,"title":["Securing Photonic NoC Architectures from Hardware Trojans"],"prefix":"10.1109","author":[{"given":"Sudeep","family":"Pasricha","sequence":"first","affiliation":[]},{"given":"Sai Vineel Reddy","family":"Chittamuru","sequence":"additional","affiliation":[]},{"given":"Ishan G","family":"Thakkar","sequence":"additional","affiliation":[]},{"given":"Varun","family":"Bhat","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2014.6974654"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1145\/2567940"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2011.5722211"},{"key":"ref30","doi-asserted-by":"crossref","DOI":"10.1145\/2947357.2947362","article-title":"A comparative analysis of front-end and back-end compatible silicon photonic on-chip interconnects","author":"thakkar","year":"2016","journal-title":"Proc SLIP"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TMSCS.2015.2481425"},{"key":"ref10","article-title":"Cross-Layer Thermal Reliability Management in Silicon Photonic Networks-on-Chip","author":"pasricha","year":"2018","journal-title":"Proc GLSVLSI"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593144"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/OIC.2012.6224445"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/3060517"},{"journal-title":"Wafer-Scale Fabrication Technology for Silicon Photonic Integrated Circuits","year":"2011","author":"selvaraja","key":"ref14"},{"key":"ref15","article-title":"Wavelength Locking and Thermally Stabilizing Microring Resonators Using Dithering Signals","volume":"32","author":"padmaraju","year":"2013","journal-title":"JLT"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2003.1183361"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1007\/s00034-013-9568-5"},{"key":"ref18","article-title":"Process Variation Aware Crosstalk Mitigation for DWDM based Photonic NoC Architectures","author":"chittamuru","year":"2016","journal-title":"Proc ISQED"},{"key":"ref19","article-title":"PICO: Mitigating Heterodyne Crosstalk Due to Process Variations and Intermodulation Effects in Photonic NoCs","author":"chittamuru","year":"2016","journal-title":"Proc DAC"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1145\/2968456.2968468"},{"key":"ref4","article-title":"Route packets, not wires","author":"dally","year":"2001","journal-title":"Proc DAC"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JSTQE.2012.2228170"},{"key":"ref3","first-page":"23","article-title":"Breakthrough silicon scanning discovers backdoor in military chip","author":"skorobogatov","year":"2012","journal-title":"Proc CHES"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/HOTI.2008.11"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2749967"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2009.2014298"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/1555754.1555808"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/3130218.3130226"},{"key":"ref2","first-page":"10","article-title":"A Survey of Hardware Trojan Taxonomy and Detection","author":"tehranipoor","year":"2009","journal-title":"IEEE Design & Test"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2010.5416626"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/HLDVT.2009.5340158"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2007.913186"},{"key":"ref22","article-title":"DSENT - a tool connecting emerging photonics with electronics for opto-electronic net-works-on-chip modeling","author":"sun","year":"2012","journal-title":"NoCS"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1364\/OE.15.010553"},{"key":"ref24","article-title":"The gem5 Simulator","author":"binkert","year":"2011","journal-title":"CA News"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1145\/1454115.1454128"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/SLIP.2017.7974906"},{"journal-title":"CACTI 6 5","year":"0","key":"ref25"}],"event":{"name":"2018 Twelfth IEEE\/ACM International Symposium on Networks-on-Chip (NOCS)","start":{"date-parts":[[2018,10,4]]},"location":"Turin","end":{"date-parts":[[2018,10,5]]}},"container-title":["2018 Twelfth IEEE\/ACM International Symposium on Networks-on-Chip (NOCS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8501313\/8512146\/08512167.pdf?arnumber=8512167","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,26]],"date-time":"2022-01-26T17:13:49Z","timestamp":1643217229000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8512167\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,10]]},"references-count":34,"URL":"https:\/\/doi.org\/10.1109\/nocs.2018.8512167","relation":{},"subject":[],"published":{"date-parts":[[2018,10]]}}}