{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,23]],"date-time":"2026-01-23T10:43:10Z","timestamp":1769164990031,"version":"3.49.0"},"reference-count":18,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,8,21]],"date-time":"2024-08-21T00:00:00Z","timestamp":1724198400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,8,21]],"date-time":"2024-08-21T00:00:00Z","timestamp":1724198400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100005046","name":"Natural Science Foundation of Heilongjiang Province","doi-asserted-by":"publisher","award":["LH-2023F015"],"award-info":[{"award-number":["LH-2023F015"]}],"id":[{"id":"10.13039\/501100005046","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100004750","name":"Aeronautical Science Foundation of China","doi-asserted-by":"publisher","award":["JZJJX20210009"],"award-info":[{"award-number":["JZJJX20210009"]}],"id":[{"id":"10.13039\/501100004750","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,8,21]]},"DOI":"10.1109\/nvmsa63038.2024.10693660","type":"proceedings-article","created":{"date-parts":[[2024,9,30]],"date-time":"2024-09-30T17:24:36Z","timestamp":1727717076000},"page":"1-6","source":"Crossref","is-referenced-by-count":2,"title":["A Compensation Principle for the Temperature Sensitivity of in-Memory Computing Arrays"],"prefix":"10.1109","author":[{"given":"Debao","family":"Wei","sequence":"first","affiliation":[{"name":"School of Electronics and Information Engineering, Harbin Institute of Technology,Harbin,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jingyuan","family":"Qu","sequence":"additional","affiliation":[{"name":"School of Electronics and Information Engineering, Harbin Institute of Technology,Harbin,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yanlong","family":"Zeng","sequence":"additional","affiliation":[{"name":"School of Electronics and Information Engineering, Harbin Institute of Technology,Harbin,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Liyan","family":"Qiao","sequence":"additional","affiliation":[{"name":"School of Electronics and Information Engineering, Harbin Institute of Technology,Harbin,China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IMW48823.2020.9108136"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/tcad.2023.3313089"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2023.3274918"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM45625.2022.10019423"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICIRCA57980.2023.10220833"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IMW52921.2022.9779250"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ITC-CSCC55581.2022.9895034"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/AICAS51828.2021.9458438"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/APCCAS55924.2022.10090358"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.3015908"},{"key":"ref11","first-page":"1","article-title":"On the Reliability of RRAMBased Neural Networks","volume-title":"Proc. IFIP\/IEEE Int. Conf. Very Large Scale Integr. (VLSI-SoC)","author":"Aziza","year":"2023"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2022.3197986"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ITCAsia55616.2022.00020"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2020.3012430"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS46773.2023.10181619"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2017.7993628"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1126\/science.ade3483"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2018.2885574"}],"event":{"name":"2024 13th Non-Volatile Memory Systems and Applications Symposium (NVMSA)","location":"Gangwon-do, Korea, Republic of","start":{"date-parts":[[2024,8,21]]},"end":{"date-parts":[[2024,8,23]]}},"container-title":["2024 13th Non-Volatile Memory Systems and Applications Symposium (NVMSA)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10693643\/10693632\/10693660.pdf?arnumber=10693660","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,10,1]],"date-time":"2024-10-01T06:44:28Z","timestamp":1727765068000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10693660\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,8,21]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/nvmsa63038.2024.10693660","relation":{},"subject":[],"published":{"date-parts":[[2024,8,21]]}}}