{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T11:29:38Z","timestamp":1730287778104,"version":"3.28.0"},"reference-count":31,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,11]]},"DOI":"10.1109\/pccc.2018.8710763","type":"proceedings-article","created":{"date-parts":[[2019,5,13]],"date-time":"2019-05-13T23:10:04Z","timestamp":1557789004000},"page":"1-8","source":"Crossref","is-referenced-by-count":0,"title":["3D-PIM NoCs with Multiple Subnetworks: A Performance and Power Evaluation"],"prefix":"10.1109","author":[{"given":"Abdel-Hameed A.","family":"Badawy","sequence":"first","affiliation":[]},{"given":"Jesus","family":"Gardea","sequence":"additional","affiliation":[]},{"given":"Yuho","family":"Jin","sequence":"additional","affiliation":[]},{"given":"Jonathan","family":"Cook","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1145\/2786572.2786596"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1145\/2600212.2600213"},{"journal-title":"Hybrid Memory Cube Specification 2 1","article-title":"Hybrid Memory Cube Consortium","year":"2014","key":"ref10"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISPASS.2013.6557149"},{"journal-title":"BookSim 2 0 User's Guide","year":"2013","author":"jiang","key":"ref12"},{"key":"ref13","article-title":"A Novel Dimensionally-Decomposed Router for On-chip Communication in 3D Architectures","author":"jongman","year":"2007","journal-title":"ISCA"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2034508"},{"key":"ref15","article-title":"High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)","volume":"1","author":"kim","year":"2011","journal-title":"IEEE Trans Components Packaging and Manufacturing Technology"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISOCC.2016.7799847"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/MDAT.2015.2455336"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/1150019.1136497"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2015.7169058"},{"journal-title":"3D Integration for NoC-based SoC Architectures","year":"2011","author":"yan","key":"ref28"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IISWC.2010.5650274"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2007.4378780"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IISWC.2009.5306797"},{"journal-title":"Principles and Practices of Interconnection Networks","year":"2003","author":"dally","key":"ref6"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1145\/2600212.2600213"},{"key":"ref5","article-title":"Enabling Vertical Wormhole Wwitching in 3D NoC-Bus Hybrid Systems","author":"chen","year":"2015","journal-title":"DATE"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2008.142"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2074070"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2016.7861524"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/3007787.3001159"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISPASS.2009.4919648"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2007.893649"},{"journal-title":"On-Chip Networks","year":"2009","author":"peh","key":"ref22"},{"journal-title":"Three-Dimensional Integrated Circuit Design","year":"2009","author":"pavlidis","key":"ref21"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/NOCS.2010.17"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1145\/1999946.1999957"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/NOCS.2012.31"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/VLSID.2006.10"}],"event":{"name":"2018 IEEE 37th International Performance Computing and Communications Conference (IPCCC)","start":{"date-parts":[[2018,11,17]]},"location":"Orlando, FL, USA","end":{"date-parts":[[2018,11,19]]}},"container-title":["2018 IEEE 37th International Performance Computing and Communications Conference (IPCCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8703513\/8710749\/08710763.pdf?arnumber=8710763","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,6,11]],"date-time":"2019-06-11T02:15:01Z","timestamp":1560219301000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8710763\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,11]]},"references-count":31,"URL":"https:\/\/doi.org\/10.1109\/pccc.2018.8710763","relation":{},"subject":[],"published":{"date-parts":[[2018,11]]}}}