{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,10]],"date-time":"2025-10-10T02:04:04Z","timestamp":1760061844338},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,7]]},"DOI":"10.1109\/prime.2019.8787819","type":"proceedings-article","created":{"date-parts":[[2019,8,6]],"date-time":"2019-08-06T01:18:06Z","timestamp":1565054286000},"source":"Crossref","is-referenced-by-count":14,"title":["Fast transient thermomechanical stress to set a pressure-assisted sintering process"],"prefix":"10.1109","author":[{"given":"Marco","family":"Santopa","sequence":"first","affiliation":[]},{"given":"Sebastiano","family":"Russo","sequence":"additional","affiliation":[]},{"given":"Marco","family":"Torrisi","sequence":"additional","affiliation":[]},{"given":"Marco","family":"Renna","sequence":"additional","affiliation":[]},{"given":"Alessandro","family":"Sitta","sequence":"additional","affiliation":[]},{"given":"Michele","family":"Calabretta","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2018.2871474"},{"key":"ref11","first-page":"1","article-title":"Assessment of thermomechanical stresses in low temperature joining technology","author":"herboth","year":"2012","journal-title":"2012 13th International Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2013.6575789"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.23919\/ISPSD.2017.7988994"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2019.2892185"},{"key":"ref4","first-page":"1","article-title":"Low temperature sinter technology die attachment for power electronic applications","author":"g\u00f6bl","year":"2010","journal-title":"2010 6th International Conference on Integrated Power Electronics Systems CIPS"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/28.67536"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISPSD.1994.583736"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2017.155"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/SMElec.2012.6417185"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2010.5702605"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-45781-9_71"},{"key":"ref1","first-page":"1","article-title":"Interface degradation of al heavy wire bonds on power semiconductors during active power cycling measured by the shear test","author":"goehre","year":"2010","journal-title":"Integrated Power Electronics Systems (CIPS) 2010 6th International Conference on"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC.2012.6542180"}],"event":{"name":"2019 15th Conference on Ph.D Research in Microelectronics and Electronics (PRIME)","location":"Lausanne, Switzerland","start":{"date-parts":[[2019,7,15]]},"end":{"date-parts":[[2019,7,18]]}},"container-title":["2019 15th Conference on Ph.D Research in Microelectronics and Electronics (PRIME)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8777448\/8787731\/08787819.pdf?arnumber=8787819","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,17]],"date-time":"2022-07-17T21:50:06Z","timestamp":1658094606000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8787819\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,7]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/prime.2019.8787819","relation":{},"subject":[],"published":{"date-parts":[[2019,7]]}}}