{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,10]],"date-time":"2025-05-10T06:27:54Z","timestamp":1746858474093},"reference-count":19,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,6,12]],"date-time":"2022-06-12T00:00:00Z","timestamp":1654992000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,6,12]],"date-time":"2022-06-12T00:00:00Z","timestamp":1654992000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,6,12]]},"DOI":"10.1109\/prime55000.2022.9816814","type":"proceedings-article","created":{"date-parts":[[2022,7,11]],"date-time":"2022-07-11T19:59:09Z","timestamp":1657569549000},"page":"17-20","source":"Crossref","is-referenced-by-count":1,"title":["Defect Detection in Double-Sided Cooled Power Modules by Structure Functions"],"prefix":"10.1109","author":[{"given":"Ciro","family":"Scognamillo","sequence":"first","affiliation":[{"name":"University Federico II,Department of Electrical Engineering and Information Technology,Naples,Italy"}]},{"given":"Antonio Pio","family":"Catalano","sequence":"additional","affiliation":[{"name":"University Federico II,Department of Electrical Engineering and Information Technology,Naples,Italy"}]},{"given":"Vincenzo","family":"d'Alessandro","sequence":"additional","affiliation":[{"name":"University Federico II,Department of Electrical Engineering and Information Technology,Naples,Italy"}]},{"given":"Lorenzo","family":"Codecasa","sequence":"additional","affiliation":[{"name":"Politecnico di Milano,Department of Electronics, Information, and Bioengineering,Milan,Italy"}]},{"given":"Alberto","family":"Castellazzi","sequence":"additional","affiliation":[{"name":"Kyoto University of Advanced Science,Solid-State Power Processing Lab,Kyoto,Japan"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/THERMINIC49743.2020.9420509"},{"year":"2022","key":"ref11","article-title":"Datasheet of the SiC-based VDMOS CREE CPMF-1200-S080B"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCT.1967.1082650"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/THERMINIC52472.2021.9626395"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/THERMINIC.2016.7749040"},{"journal-title":"EIA \/ JEDEC Standard JESD51-14","article-title":"Transient dual interface test method for the measurement of the thermal resistance junction-to-case of semiconductor devices with heat flow through a single path","year":"2010","key":"ref15"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2021.3073647"},{"journal-title":"User’s Guide Release 5 3A","year":"2018","key":"ref17"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-7091-0560-3"},{"journal-title":"V A Heat Transfer Textbook","year":"2008","author":"lienhard iv","key":"ref19"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2020.3007146"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2012.2196799"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/0038-1101(88)90099-8"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2020.113742"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2007.906315"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2004.843204"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1002\/9781118755525"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MIE.2012.2193291"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/IPEC.2014.6870097"}],"event":{"name":"2022 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME)","start":{"date-parts":[[2022,6,12]]},"location":"Villasimius, SU, Italy","end":{"date-parts":[[2022,6,15]]}},"container-title":["2022 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9816371\/9816743\/09816814.pdf?arnumber=9816814","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,8,8]],"date-time":"2022-08-08T19:59:04Z","timestamp":1659988744000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9816814\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,6,12]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/prime55000.2022.9816814","relation":{},"subject":[],"published":{"date-parts":[[2022,6,12]]}}}