{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,1]],"date-time":"2025-08-01T18:40:04Z","timestamp":1754073604246,"version":"3.41.2"},"reference-count":24,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,4,22]],"date-time":"2025-04-22T00:00:00Z","timestamp":1745280000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,4,22]],"date-time":"2025-04-22T00:00:00Z","timestamp":1745280000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100004543","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2023YFB4403600"],"award-info":[{"award-number":["2023YFB4403600"]}],"id":[{"id":"10.13039\/501100004543","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,4,22]]},"DOI":"10.1109\/rfid64926.2025.11015507","type":"proceedings-article","created":{"date-parts":[[2025,5,28]],"date-time":"2025-05-28T13:50:29Z","timestamp":1748440229000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["Simultaneous Temperature and Capacitance Sensing With Self Decoupling for Analog Pulse-Width-Modulation Backscatter"],"prefix":"10.1109","author":[{"given":"Taotao","family":"Wu","sequence":"first","affiliation":[{"name":"School of Microelectronics, Fudan University,Shanghai,China"}]},{"given":"Yuxiao","family":"Zhao","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Fudan University,Shanghai,China"}]},{"given":"Xiaochuan","family":"Peng","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Fudan University,Shanghai,China"}]},{"given":"Jing","family":"Feng","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Fudan University,Shanghai,China"}]},{"given":"Hao","family":"Min","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Fudan University,Shanghai,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3057766"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2019.8902918"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2024.3396842"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2018.2861431"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JIOT.2021.3095136"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2018.2803203"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2004.1321406"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/RFID52461.2021.9444326"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/RFID62091.2024.10582737"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2018.8357045"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/RFID.2019.8719264"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/IMS19712.2021.9574808"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/PRIME.2013.6603157"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2164134"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2758327"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2989585"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2023.3286348"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/BioCAS54905.2022.9948640"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2021.3134010"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2021.3072398"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2023.3341260"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2024.3370183"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2019.2952855"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.3390\/s150511442"}],"event":{"name":"2025 IEEE International Conference on RFID (RFID)","start":{"date-parts":[[2025,4,22]]},"location":"Atlanta, GA, USA","end":{"date-parts":[[2025,4,24]]}},"container-title":["2025 IEEE International Conference on RFID (RFID)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11015504\/11015505\/11015507.pdf?arnumber=11015507","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,1]],"date-time":"2025-08-01T18:06:52Z","timestamp":1754071612000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11015507\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,4,22]]},"references-count":24,"URL":"https:\/\/doi.org\/10.1109\/rfid64926.2025.11015507","relation":{},"subject":[],"published":{"date-parts":[[2025,4,22]]}}}