{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T13:20:19Z","timestamp":1730294419584,"version":"3.28.0"},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2020,1,1]],"date-time":"2020-01-01T00:00:00Z","timestamp":1577836800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,1,1]],"date-time":"2020-01-01T00:00:00Z","timestamp":1577836800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,1,1]],"date-time":"2020-01-01T00:00:00Z","timestamp":1577836800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,1]]},"DOI":"10.1109\/rws45077.2020.9050057","type":"proceedings-article","created":{"date-parts":[[2020,3,31]],"date-time":"2020-03-31T00:20:18Z","timestamp":1585614018000},"page":"326-329","source":"Crossref","is-referenced-by-count":0,"title":["Advanced Thermal Modeling of IC \u2013 Package Interaction"],"prefix":"10.1109","author":[{"given":"Zhibo","family":"Cao","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Matteo","family":"Stocchi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Matthias","family":"Wietstruck","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Federico","family":"Garbuglia","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Diego","family":"Pincini","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mehmet","family":"Kaynak","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/SIRF.2018.8304232"},{"journal-title":"Heat Transfer – A Practical Approach","year":"2002","author":"cengel","key":"ref3"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2009.4810784"},{"key":"ref6","first-page":"968613","article-title":"Simulation and analysis of image sensor's TEC cooling package based on ANSYS Icepak","volume":"9686","author":"wu","year":"2016","journal-title":"8th International Symposium on Advanced Optical Manufacturing and Testing Technologies Optoelectronic Materials and Devices"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/EIConRus.2019.8657035"},{"key":"ref8","article-title":"Thermal Analysis of Rectangular and Tapered Pin fins heat sink using Icepak","author":"kumar","year":"2016","journal-title":"International Conference on Allied Technologies in Electrical & Communication systems"},{"key":"ref7","article-title":"Analysis Research of the IGBT’s radiator based on ICEPAK","author":"wang","year":"2015","journal-title":"5th International Conference on Advanced Design and Manufacturing Engineering"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1115\/1.2792113"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2011.6184481"},{"year":"0","key":"ref1","article-title":"U.S. air force avionics integrity program notes"}],"event":{"name":"2020 IEEE Radio and Wireless Symposium (RWS)","start":{"date-parts":[[2020,1,26]]},"location":"San Antonio, TX, USA","end":{"date-parts":[[2020,1,29]]}},"container-title":["2020 IEEE Radio and Wireless Symposium (RWS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9037564\/9049977\/09050057.pdf?arnumber=9050057","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,28]],"date-time":"2022-06-28T17:56:04Z","timestamp":1656438964000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9050057\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,1]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/rws45077.2020.9050057","relation":{},"subject":[],"published":{"date-parts":[[2020,1]]}}}