{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,22]],"date-time":"2026-04-22T19:17:42Z","timestamp":1776885462429,"version":"3.51.2"},"reference-count":16,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,1,22]],"date-time":"2023-01-22T00:00:00Z","timestamp":1674345600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,1,22]],"date-time":"2023-01-22T00:00:00Z","timestamp":1674345600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000185","name":"DARPA","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100000185","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,1,22]]},"DOI":"10.1109\/rws55624.2023.10046317","type":"proceedings-article","created":{"date-parts":[[2023,2,22]],"date-time":"2023-02-22T18:25:35Z","timestamp":1677090335000},"page":"98-100","source":"Crossref","is-referenced-by-count":6,"title":["Design and Characterization of Bandpass Filter with Multiple Zeros on Glass Interposer for 6G Applications"],"prefix":"10.1109","author":[{"given":"Xingchen","family":"Li","sequence":"first","affiliation":[{"name":"School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology,Atlanta,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaofan","family":"Jia","sequence":"additional","affiliation":[{"name":"School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology,Atlanta,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Serhat","family":"Erdogan","sequence":"additional","affiliation":[{"name":"School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology,Atlanta,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Madhavan","family":"Swaminathan","sequence":"additional","affiliation":[{"name":"School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology,Atlanta,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/BCICTS50416.2021.9682212"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51906.2022.00069"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2005.864118"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1049\/el.2015.3112"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/7260.928933"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2005.850442"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2008.2003461"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1002\/0471221619"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2018.00164"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC32862.2020.00218"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC32696.2021.00188"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2018.8439601"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ICMMT.2012.6230109"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2017.8058848"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2015.2502420"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TTHZ.2018.2823541"}],"event":{"name":"2023 IEEE Radio and Wireless Symposium (RWS)","location":"Las Vegas, NV, USA","start":{"date-parts":[[2023,1,22]]},"end":{"date-parts":[[2023,1,25]]}},"container-title":["2023 IEEE Radio and Wireless Symposium (RWS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10046195\/10046291\/10046317.pdf?arnumber=10046317","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,13]],"date-time":"2024-02-13T17:06:42Z","timestamp":1707844002000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10046317\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,1,22]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/rws55624.2023.10046317","relation":{},"subject":[],"published":{"date-parts":[[2023,1,22]]}}}