{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,30]],"date-time":"2026-01-30T06:31:49Z","timestamp":1769754709214,"version":"3.49.0"},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,1,22]],"date-time":"2023-01-22T00:00:00Z","timestamp":1674345600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,1,22]],"date-time":"2023-01-22T00:00:00Z","timestamp":1674345600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100013412","name":"Honeywell Federal Manufacturing & Technologies, LLC","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100013412","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,1,22]]},"DOI":"10.1109\/rws55624.2023.10046346","type":"proceedings-article","created":{"date-parts":[[2023,2,22]],"date-time":"2023-02-22T18:25:35Z","timestamp":1677090335000},"page":"125-128","source":"Crossref","is-referenced-by-count":3,"title":["A Power-Efficient Compact Ku-Band System-on-Antenna Module with Chip-First Package Integration"],"prefix":"10.1109","author":[{"given":"Xenofon","family":"Konstantinou","sequence":"first","affiliation":[{"name":"Michigan State University,Electrical and Computer Engineering,East Lansing,MI,USA,48824"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Nicholas","family":"Sturim","sequence":"additional","affiliation":[{"name":"Michigan State University,Electrical and Computer Engineering,East Lansing,MI,USA,48824"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"John D.","family":"Albrecht","sequence":"additional","affiliation":[{"name":"Michigan State University,Electrical and Computer Engineering,East Lansing,MI,USA,48824"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Premjeet","family":"Chahal","sequence":"additional","affiliation":[{"name":"Michigan State University,Electrical and Computer Engineering,East Lansing,MI,USA,48824"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"John","family":"Papapolymerou","sequence":"additional","affiliation":[{"name":"Michigan State University,Electrical and Computer Engineering,East Lansing,MI,USA,48824"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MMM.2017.2759541"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2016.7540084"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2014.6848597"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC.2018.8546400"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2020.2992074"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2021.3076066"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.23919\/EuMIC.2017.8230736"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/COMCAS52219.2021.9629015"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2019.2961345"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.4071\/2380-7016-47.6.1"},{"key":"ref11","volume-title":"Additive Manufacturing for RF Electronics Packaging","author":"Oakley","year":"2020"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/IMS30576.2020.9223793"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2022.3160626"}],"event":{"name":"2023 IEEE Radio and Wireless Symposium (RWS)","location":"Las Vegas, NV, USA","start":{"date-parts":[[2023,1,22]]},"end":{"date-parts":[[2023,1,25]]}},"container-title":["2023 IEEE Radio and Wireless Symposium (RWS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10046195\/10046291\/10046346.pdf?arnumber=10046346","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,13]],"date-time":"2024-02-13T17:30:15Z","timestamp":1707845415000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10046346\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,1,22]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/rws55624.2023.10046346","relation":{},"subject":[],"published":{"date-parts":[[2023,1,22]]}}}