{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,26]],"date-time":"2025-09-26T13:28:19Z","timestamp":1758893299735},"reference-count":18,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,9]]},"DOI":"10.1109\/sbcci.2013.6644891","type":"proceedings-article","created":{"date-parts":[[2013,10,30]],"date-time":"2013-10-30T20:12:39Z","timestamp":1383163959000},"page":"1-6","source":"Crossref","is-referenced-by-count":8,"title":["Lasio 3D NoC vertical links serialization: Evaluation of latency and buffer occupancy"],"prefix":"10.1109","author":[{"given":"Yan","family":"Ghidini","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Matheus","family":"Moreira","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lucas","family":"Brahm","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Thais","family":"Webber","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ney","family":"Calazans","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Cesar","family":"Marcon","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"17","doi-asserted-by":"publisher","DOI":"10.1145\/981066.981091"},{"key":"18","article-title":"Principles and practices on interconnectionnetworks","author":"dally","year":"2004","journal-title":"Elsevier"},{"key":"15","article-title":"A study of through silicon via impact to 3d network-on-chip design","author":"xu","year":"2010","journal-title":"ICEIE"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681638"},{"key":"13","doi-asserted-by":"crossref","first-page":"581","DOI":"10.1145\/1629911.1630061","article-title":"exploring serial vertical interconnects for 3d ics","author":"pasricha","year":"2009","journal-title":"2009 46th ACM\/IEEE Design Automation Conference dac"},{"key":"14","article-title":"3d network-on-chip system communication usingminimum number of tsvs","author":"yong","year":"2011","journal-title":"ICTC"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.873612"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2011.239"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/LES.2009.2034710"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1007\/b105353"},{"key":"1","article-title":"A noc performance evaluation platform supportingdesigns at multiple levels of abstraction","author":"fu","year":"2009","journal-title":"ICIEA"},{"key":"10","doi-asserted-by":"crossref","first-page":"562","DOI":"10.1145\/1278480.1278623","article-title":"interconnects in the third dimension: design challenges for 3d ics","author":"bernstein","year":"2007","journal-title":"2007 44th ACM\/IEEE Design Automation Conference DAC"},{"journal-title":"Three-dimensional Integrated CircuitDesign","year":"2008","author":"pavlidis","key":"7"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2007.893649"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/NORCHIP.2010.5669453"},{"key":"4","article-title":"Lastz: An ultra optimized 3d networks-on-chiparchitecture","author":"rahmani","year":"2011","journal-title":"EUROMICRO DSD"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2004.03.003"},{"key":"8","article-title":"Vertical interconnects squeezing in symmetric 3d meshnetwork-on-chip","author":"liu","year":"2011","journal-title":"ASP-DAC"}],"event":{"name":"2013 26th Symposium on Integrated Circuits and Systems Design (SBCCI)","start":{"date-parts":[[2013,9,2]]},"location":"Curitiba, Brazil","end":{"date-parts":[[2013,9,6]]}},"container-title":["2013 26th Symposium on Integrated Circuits and Systems Design (SBCCI)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6634599\/6644849\/06644891.pdf?arnumber=6644891","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,21]],"date-time":"2017-06-21T21:07:33Z","timestamp":1498079253000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6644891\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,9]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/sbcci.2013.6644891","relation":{},"subject":[],"published":{"date-parts":[[2013,9]]}}}