{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,2]],"date-time":"2025-08-02T19:27:50Z","timestamp":1754162870763,"version":"3.41.2"},"reference-count":11,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/sensors43011.2019.8956571","type":"proceedings-article","created":{"date-parts":[[2020,1,15]],"date-time":"2020-01-15T03:50:51Z","timestamp":1579060251000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["Simultaneous Microfluidic Flow Velocity and Thermal Conductivity Measurement Utilizing Screen Printed Thermal Sensors"],"prefix":"10.1109","author":[{"given":"Christina","family":"Offenzeller","sequence":"first","affiliation":[{"name":"Johannes Kepler University Linz,Institute for Microelectronics and Microsensors,Linz,Austria,4040"}]},{"given":"Marcus A.","family":"Hinterm\u00fcller","sequence":"additional","affiliation":[{"name":"Johannes Kepler University Linz,Institute for Microelectronics and Microsensors,Linz,Austria,4040"}]},{"given":"Marcel","family":"Knoll","sequence":"additional","affiliation":[{"name":"Johannes Kepler University Linz,Institute for Microelectronics and Microsensors,Linz,Austria,4040"}]},{"given":"Bernhard","family":"Jakoby","sequence":"additional","affiliation":[{"name":"Johannes Kepler University Linz,Institute for Microelectronics and Microsensors,Linz,Austria,4040"}]},{"given":"Wolfgang","family":"Hilber","sequence":"additional","affiliation":[{"name":"Johannes Kepler University Linz,Institute for Microelectronics and Microsensors,Linz,Austria,4040"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/13\/4\/317"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.1993.296928"},{"article-title":"Enhancing thermal conductivity of fluids with nanoparticles","year":"1995","author":"choi","key":"ref10"},{"key":"ref6","article-title":"Screen printed thermal flow velocity sensor for microfluidic devices featuring intrinsic compensation of spurious heat transfer","author":"offenzeller","year":"2019","journal-title":"Proc Int Conf Solid State Sens Actuators Microsyst"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.tca.2008.01.008"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1007\/s003480050366"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-999-0211-y"},{"journal-title":"Thermoelectric effects in metals thermocouples","year":"2001","author":"kasap","key":"ref7"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2008.04.043"},{"year":"0","key":"ref9","article-title":"Galden LS\/HS"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1115\/1.2712475"}],"event":{"name":"2019 IEEE SENSORS","start":{"date-parts":[[2019,10,27]]},"location":"Montreal, QC, Canada","end":{"date-parts":[[2019,10,30]]}},"container-title":["2019 IEEE SENSORS"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8949872\/8956486\/08956571.pdf?arnumber=8956571","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,30]],"date-time":"2025-07-30T18:44:02Z","timestamp":1753901042000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8956571\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/sensors43011.2019.8956571","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}