{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,2]],"date-time":"2025-08-02T19:46:27Z","timestamp":1754163987947,"version":"3.41.2"},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/sensors43011.2019.8956807","type":"proceedings-article","created":{"date-parts":[[2020,1,15]],"date-time":"2020-01-15T03:50:51Z","timestamp":1579060251000},"page":"1-3","source":"Crossref","is-referenced-by-count":0,"title":["Vacuum-assisted selective adhesive imprinting for heterogeneous system integration of MOEMS devices : Automated assembly of miniaturized PM sensor"],"prefix":"10.1109","author":[{"given":"Jaka","family":"Pribo\u0161ek","sequence":"first","affiliation":[{"name":"Silicon Austria Labs,Austria"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Markus","family":"Zauner","sequence":"additional","affiliation":[{"name":"Silicon Austria Labs,Austria"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jochen","family":"Bardong","sequence":"additional","affiliation":[{"name":"Silicon Austria Labs,Austria"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Alfred","family":"Binder","sequence":"additional","affiliation":[{"name":"Silicon Austria Labs,Austria"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Paul","family":"Maierhofer","sequence":"additional","affiliation":[{"name":"Graz University of Technology,Institute of Electronic Sensor Systems,Graz,Austria"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Alexander","family":"Bergmann","sequence":"additional","affiliation":[{"name":"Graz University of Technology,Institute of Electronic Sensor Systems,Graz,Austria"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Georg","family":"R\u00f6hrer","sequence":"additional","affiliation":[{"name":"ams AG,Premstätten,Austria"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1117\/12.696544"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2012.12.037"},{"key":"ref6","article-title":"Towards a Highly-Integrated Low-Cost PM Sensor","author":"maierhofer","year":"0","journal-title":"Accepted in Proc of AAAR 2019"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1007\/s10404-012-1011-x"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.3390\/proceedings2130850"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(03)00202-4"},{"article-title":"A simple bonding process of SU-8 to glass to seal a microfluidic device","year":"2007","author":"serra","key":"ref1"}],"event":{"name":"2019 IEEE SENSORS","start":{"date-parts":[[2019,10,27]]},"location":"Montreal, QC, Canada","end":{"date-parts":[[2019,10,30]]}},"container-title":["2019 IEEE SENSORS"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8949872\/8956486\/08956807.pdf?arnumber=8956807","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,31]],"date-time":"2025-07-31T18:25:23Z","timestamp":1753986323000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8956807\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/sensors43011.2019.8956807","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}