{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,1]],"date-time":"2026-02-01T03:25:05Z","timestamp":1769916305210,"version":"3.49.0"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/sensors43011.2019.8956845","type":"proceedings-article","created":{"date-parts":[[2020,1,15]],"date-time":"2020-01-15T03:50:51Z","timestamp":1579060251000},"page":"1-3","source":"Crossref","is-referenced-by-count":3,"title":["A Novel Packaging Stress Isolation Chip for MEMS Devices"],"prefix":"10.1109","author":[{"given":"Bowen","family":"Xing","sequence":"first","affiliation":[{"name":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084"}]},{"given":"Bin","family":"Zhou","sequence":"additional","affiliation":[{"name":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084"}]},{"given":"Jin","family":"Wang","sequence":"additional","affiliation":[{"name":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084"}]},{"given":"Bo","family":"Hou","sequence":"additional","affiliation":[{"name":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084"}]},{"given":"Xiang","family":"Li","sequence":"additional","affiliation":[{"name":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084"}]},{"given":"Qi","family":"Wei","sequence":"additional","affiliation":[{"name":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084"}]},{"given":"Rong","family":"Zhang","sequence":"additional","affiliation":[{"name":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"crossref","first-page":"113","DOI":"10.1016\/0924-4247(94)00872-F","article-title":"Selection of glass, anodic bonding conditions and material compatibility for silicon-glass capacitive sensors","volume":"46","author":"rogers","year":"1995","journal-title":"Sensors and Actuators A Physical"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"2603","DOI":"10.3390\/s18082603","article-title":"Measurement and Isolation of Thermal Stress in Silicon-On-Glass MEMS Structures","volume":"18","author":"chen","year":"2018","journal-title":"SENSORS"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISISS.2016.7435540"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2016.2646723"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/6104.924788"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2007.897948"}],"event":{"name":"2019 IEEE SENSORS","location":"Montreal, QC, Canada","start":{"date-parts":[[2019,10,27]]},"end":{"date-parts":[[2019,10,30]]}},"container-title":["2019 IEEE SENSORS"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8949872\/8956486\/08956845.pdf?arnumber=8956845","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,19]],"date-time":"2025-08-19T18:10:19Z","timestamp":1755627019000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8956845\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/sensors43011.2019.8956845","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}