{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,2]],"date-time":"2025-09-02T00:03:51Z","timestamp":1756771431254,"version":"3.44.0"},"reference-count":29,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/sensors43011.2019.8956879","type":"proceedings-article","created":{"date-parts":[[2020,1,15]],"date-time":"2020-01-15T03:50:51Z","timestamp":1579060251000},"page":"1-4","source":"Crossref","is-referenced-by-count":3,"title":["Fabrication and Experimental Characterization of a MEMS Microphone Using Electrostatic Levitation"],"prefix":"10.1109","author":[{"given":"Mehmet","family":"Ozdogan","sequence":"first","affiliation":[{"name":"State University of New York at Binghamton,Department of Mechanical Engineering,Binghamton,NY,USA,13902"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shahrzad","family":"Towfighian","sequence":"additional","affiliation":[{"name":"State University of New York at Binghamton,Department of Mechanical Engineering,Binghamton,NY,USA,13902"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ronald N.","family":"Miles","sequence":"additional","affiliation":[{"name":"State University of New York at Binghamton,Department of Mechanical Engineering,Binghamton,NY,USA,13902"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","first-page":"63","article-title":"A robust miniature silicon microphone diaphragm","volume":"7","author":"cui","year":"2009","journal-title":"Sensors & Transducers"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2014.2329136"},{"journal-title":"Dissertation High Performance Piezoelectric MEMS Microphones","year":"2010","author":"littrell","key":"ref12"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2011.2176921"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2014.2361118"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2017.04.001"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2009.2031810"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1121\/1.3082118"},{"journal-title":"Design fabrication and characterization of a mems dual-backplate capacitive microphone","year":"2007","author":"martin","key":"ref18"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2018.2837143"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2019.02.007"},{"key":"ref4","first-page":"241","article-title":"Design´ and modeling of a MEMS dual-backplate capacitive microphone with spring-supported diaphragm for mobile device applications","volume":"18","author":"pena-garc\u02dc \u00b4?a nn","year":"2018","journal-title":"Sensors (Basel)"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2008.921710"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TRANSDUCERS.2015.7180939"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/84.294323"},{"journal-title":"A Physical Approach to Engineering Acoustics","year":"2019","author":"miles","key":"ref29"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1121\/1.390738"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.2005.1453931"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(01)00736-1"},{"journal-title":"Ethical Ripples of Creativity and Innovation The Internet of Things","year":"2016","author":"xiaoyi","key":"ref2"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2007.909234"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ITechA.2015.7317398"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/SENSOR.1991.148898"},{"journal-title":"Handbook of Modern Sensors Physics Designs and Applications","year":"2011","author":"ghodssi","key":"ref22"},{"key":"ref21","first-page":"8","article-title":"Micromachined condenser microphone for hearing aid use","author":"schafer","year":"1998","journal-title":"Solid-State Sensor and Actuator Workshop"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.3390\/mi7030042"},{"key":"ref23","first-page":"8","article-title":"A MEMS microphone using repulsive force sensors","volume":"4","author":"ozdogan","year":"1998","journal-title":"ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2005.851682"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2018.2841345"}],"event":{"name":"2019 IEEE SENSORS","start":{"date-parts":[[2019,10,27]]},"location":"Montreal, QC, Canada","end":{"date-parts":[[2019,10,30]]}},"container-title":["2019 IEEE SENSORS"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8949872\/8956486\/08956879.pdf?arnumber=8956879","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T19:21:31Z","timestamp":1756754491000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8956879\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":29,"URL":"https:\/\/doi.org\/10.1109\/sensors43011.2019.8956879","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}