{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T21:52:02Z","timestamp":1725659522352},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,10,31]],"date-time":"2021-10-31T00:00:00Z","timestamp":1635638400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,10,31]],"date-time":"2021-10-31T00:00:00Z","timestamp":1635638400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,10,31]],"date-time":"2021-10-31T00:00:00Z","timestamp":1635638400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,10,31]]},"DOI":"10.1109\/sensors47087.2021.9639863","type":"proceedings-article","created":{"date-parts":[[2021,12,17]],"date-time":"2021-12-17T20:35:41Z","timestamp":1639773341000},"source":"Crossref","is-referenced-by-count":0,"title":["A Simplified Analytical Damping Constant Model for Perforated Proof Mass Structure of MEMS Capacitive Accelerometer by Multi-Layer Metal Technology"],"prefix":"10.1109","author":[{"given":"Kohei","family":"Shibata","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Akihiro","family":"Uchiyama","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Akira","family":"Onishi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shin-ichi","family":"Iida","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Toshifumi","family":"Konishi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Noboru","family":"Ishihara","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Katsuyuki","family":"Machida","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kazuya","family":"Masu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hiroyuki","family":"Ito","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2007.01.008"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/13\/6\/301"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.3390\/s150407388"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2008.921675"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/4.494198"},{"key":"ref4","doi-asserted-by":"crossref","DOI":"10.7567\/SSDM.2020.C-9-02","article-title":"A High Resolution Single Gold Proof-Mass CMOS-MEMS Accelerometer","author":"ichikawa","year":"2020","journal-title":"Proc 2020 International Conference on Solid State Devices and Materials (SSDM 2020) C-9-02 Online"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1149\/09705.0091ecst"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICSENS.2016.7808793"},{"key":"ref5","first-page":"133","author":"machida","year":"2019","journal-title":"Multi-Physics Simulation Platform and Multi-Layer Metal Technology for CMOS-MEMS Accelerometer with Gold Proof Mass"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/84.896777"},{"key":"ref7","first-page":"335","author":"senturia","year":"2001","journal-title":"Microsystem Design"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ICSENS.2015.7370303"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2013.6495768"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/SOLSEN.1990.109817"}],"event":{"name":"2021 IEEE Sensors","location":"Sydney, Australia","start":{"date-parts":[[2021,10,31]]},"end":{"date-parts":[[2021,11,3]]}},"container-title":["2021 IEEE Sensors"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9639447\/9639235\/09639863.pdf?arnumber=9639863","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,1,19]],"date-time":"2023-01-19T02:25:54Z","timestamp":1674095154000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9639863\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,10,31]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/sensors47087.2021.9639863","relation":{},"subject":[],"published":{"date-parts":[[2021,10,31]]}}}