{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,14]],"date-time":"2025-11-14T17:31:13Z","timestamp":1763141473345,"version":"3.37.3"},"reference-count":19,"publisher":"IEEE","license":[{"start":{"date-parts":[[2020,10,25]],"date-time":"2020-10-25T00:00:00Z","timestamp":1603584000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,10,25]],"date-time":"2020-10-25T00:00:00Z","timestamp":1603584000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,10,25]],"date-time":"2020-10-25T00:00:00Z","timestamp":1603584000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001352","name":"National University of Singapore","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001352","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,10,25]]},"DOI":"10.1109\/sensors47125.2020.9278879","type":"proceedings-article","created":{"date-parts":[[2020,12,10]],"date-time":"2020-12-10T03:29:29Z","timestamp":1607570969000},"page":"1-4","source":"Crossref","is-referenced-by-count":3,"title":["Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance"],"prefix":"10.1109","author":[{"given":"Jieming","family":"Pan","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yida","family":"Li","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuxuan","family":"Luo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"XiangYu","family":"Zhang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zaifeng","family":"Yang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"David Liang","family":"Tai Wong","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xuhua","family":"Niu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chen-Khong","family":"Tham","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Aaron Voon-Yew","family":"Thean","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/S0955-5986(00)00018-2"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.3390\/ma12091458"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1049\/piee.1970.0232"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.3390\/s141120149"},{"key":"ref14","first-page":"1","article-title":"A 7×7×2mm3 8.60¼ 500-kb\/s Transmitter with Robust Injection-Locking Based Frequencyto-Amplitude Conversion Receiver Targeting for Implantable Applications","author":"xiong","year":"2019","journal-title":"2019 IEEE Custom Integrated Circuits Conference (CICC)"},{"key":"ref15","doi-asserted-by":"crossref","first-page":"31503","DOI":"10.1063\/1.5074181","article-title":"A flexible InGaAs nanomembrane PhotoFET with tunable responsivities in near- and short-wave IR region for lightweight imaging applications","volume":"7","author":"li","year":"2019","journal-title":"Apl Materials"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/38.674972"},{"journal-title":"Simulation study of sensor of ECT system based on COMSOL","year":"2018","author":"yang","key":"ref17"},{"key":"ref18","doi-asserted-by":"crossref","first-page":"3708","DOI":"10.1021\/ie0713590","article-title":"Electrical Capacitance Tomography ? A Perspective","volume":"47","author":"marashdeh","year":"2008","journal-title":"Industrial & Engineering Chemistry Research"},{"key":"ref19","first-page":"325","article-title":"Glossary of Terms in Wafers, Waffles and Adjuncts","author":"karl","year":"2018"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2977716"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.31399\/asm.tb.imub.9781627083058"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063079"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2020.3010318"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.3390\/mi8080249"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1002\/aelm.201800463"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1299\/jamdsm.1.338"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-2244(97)00003-4"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ICSENS.2017.8234000"}],"event":{"name":"2020 IEEE SENSORS","start":{"date-parts":[[2020,10,25]]},"location":"Rotterdam, Netherlands","end":{"date-parts":[[2020,10,28]]}},"container-title":["2020 IEEE SENSORS"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9278450\/9278578\/09278879.pdf?arnumber=9278879","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,30]],"date-time":"2022-06-30T15:18:10Z","timestamp":1656602290000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9278879\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,10,25]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/sensors47125.2020.9278879","relation":{},"subject":[],"published":{"date-parts":[[2020,10,25]]}}}