{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T08:33:46Z","timestamp":1725611626997},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,10,30]],"date-time":"2022-10-30T00:00:00Z","timestamp":1667088000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,10,30]],"date-time":"2022-10-30T00:00:00Z","timestamp":1667088000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,10,30]]},"DOI":"10.1109\/sensors52175.2022.9967127","type":"proceedings-article","created":{"date-parts":[[2022,12,8]],"date-time":"2022-12-08T18:42:41Z","timestamp":1670524961000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["A Heat Conduction Structure for the Etching Process of MEMS Devices with Support Anchors"],"prefix":"10.1109","author":[{"given":"Jianjun","family":"Ma","sequence":"first","affiliation":[{"name":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bowen","family":"Xing","sequence":"additional","affiliation":[{"name":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Pu","family":"Chen","sequence":"additional","affiliation":[{"name":"East China Institute of Photo-Electron IC,Bengbu,China,233030"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bin","family":"Zhou","sequence":"additional","affiliation":[{"name":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qi","family":"Wei","sequence":"additional","affiliation":[{"name":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Rong","family":"Zhang","sequence":"additional","affiliation":[{"name":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISISS.2018.8358123"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1116\/1.1428276"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISISS.2016.7435540"},{"key":"ref2","article-title":"Sensitivity to Over-Etching of Improved V -Shaped Microcantilever","author":"subramanian","year":"2012","journal-title":"Advanced Materials Research (Vol 403 pp 3376–3379) Trans Tech Publications Ltd"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1149\/1.1391611"}],"event":{"name":"2022 IEEE Sensors","start":{"date-parts":[[2022,10,30]]},"location":"Dallas, TX, USA","end":{"date-parts":[[2022,11,2]]}},"container-title":["2022 IEEE Sensors"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9966996\/9966997\/09967127.pdf?arnumber=9967127","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,26]],"date-time":"2022-12-26T19:46:06Z","timestamp":1672083966000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9967127\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10,30]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/sensors52175.2022.9967127","relation":{},"subject":[],"published":{"date-parts":[[2022,10,30]]}}}