{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T13:37:38Z","timestamp":1730295458223,"version":"3.28.0"},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,10,30]],"date-time":"2022-10-30T00:00:00Z","timestamp":1667088000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,10,30]],"date-time":"2022-10-30T00:00:00Z","timestamp":1667088000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,10,30]]},"DOI":"10.1109\/sensors52175.2022.9967132","type":"proceedings-article","created":{"date-parts":[[2022,12,8]],"date-time":"2022-12-08T13:42:41Z","timestamp":1670506961000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["Design Optimization of CMOS- MEMS Staggered Vertical Comb Based Micro Scanners"],"prefix":"10.1109","author":[{"given":"Wenhao","family":"Chen","sequence":"first","affiliation":[{"name":"The Hong Kong University of Science and Technology,Department of Mechanical and Aerospace Engineering,Hong Kong"}]},{"given":"Mingzheng","family":"Duani","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology,Department of Mechanical and Aerospace Engineering,Hong Kong"}]},{"given":"Hadi","family":"Tavakkoli","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology,Department of Mechanical and Aerospace Engineering,Hong Kong"}]},{"given":"Huahuang","family":"Luo","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology,Department of Mechanical and Aerospace Engineering,Hong Kong"}]},{"given":"Bin","family":"Zhao","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology,Department of Mechanical and Aerospace Engineering,Hong Kong"}]},{"given":"Wibool","family":"Piyawattanametha","sequence":"additional","affiliation":[{"name":"King Mongkut's Institute of Technology Ladkrabang,Department of Biomedical Engineering,Bangkok,Thailand"}]},{"given":"Yi-Kuen","family":"Lee","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology,Department of Mechanical and Aerospace Engineering,Hong Kong"}]}],"member":"263","reference":[{"key":"ref10","article-title":"Air damping of high performance resonating micro-mirrors with angular vertical comb-drive actuators","author":"farrugia","year":"2019","journal-title":"Microsystem Technologies"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.3390\/mi11050456"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2017.11.043"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.optlaseng.2012.07.019"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.2009.4805558"},{"key":"ref4","first-page":"1219","article-title":"Single-Chip Integration of CMOS Compatible Mems Temperature\/Humidity and Highly Sensitive Flow Sensors for Human Thermal Comfort Sensing Application","author":"xu","year":"0","journal-title":"2021 21 st International Conference on Solid-State Sensors Actuators and Microsystems (Transducers)"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2017.2672693"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2018.2834549"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/LSENS.2019.2893151"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2005.859073"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2003.811728"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2013.2295470"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.3390\/mi3020509"},{"key":"ref9","volume":"567","author":"timoshenko","year":"1970","journal-title":"Theory of Elasticity 3rd ed"}],"event":{"name":"2022 IEEE Sensors","start":{"date-parts":[[2022,10,30]]},"location":"Dallas, TX, USA","end":{"date-parts":[[2022,11,2]]}},"container-title":["2022 IEEE Sensors"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9966996\/9966997\/09967132.pdf?arnumber=9967132","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,26]],"date-time":"2022-12-26T14:47:00Z","timestamp":1672066020000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9967132\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10,30]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/sensors52175.2022.9967132","relation":{},"subject":[],"published":{"date-parts":[[2022,10,30]]}}}