{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T13:37:45Z","timestamp":1730295465399,"version":"3.28.0"},"reference-count":15,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,10,30]],"date-time":"2022-10-30T00:00:00Z","timestamp":1667088000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,10,30]],"date-time":"2022-10-30T00:00:00Z","timestamp":1667088000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,10,30]]},"DOI":"10.1109\/sensors52175.2022.9967153","type":"proceedings-article","created":{"date-parts":[[2022,12,8]],"date-time":"2022-12-08T18:42:41Z","timestamp":1670524961000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["Towards Integrated Optical Feedback FM-to-AM Conversion in Silicon Nitride for Displacement Sensing Applications"],"prefix":"10.1109","author":[{"given":"Clement","family":"Deleau","sequence":"first","affiliation":[{"name":"LAAS-CNRS,Toulouse,FRANCE"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Thidsanu","family":"Apiphatnaphakul","sequence":"additional","affiliation":[{"name":"LAAS-CNRS,Toulouse,FRANCE"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Han Cheng","family":"Seat","sequence":"additional","affiliation":[{"name":"LAAS-CNRS,Toulouse,FRANCE"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Frederic","family":"Surre","sequence":"additional","affiliation":[{"name":"James Watt School of Engineering, University of Glasgow,Glasgow,UK"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Usman","family":"Zabit","sequence":"additional","affiliation":[{"name":"School of EECS, National University of Sciences and Technology (NUST),Islamabad,PAKISTAN"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Franck","family":"Carcenac","sequence":"additional","affiliation":[{"name":"LAAS-CNRS,Toulouse,FRANCE"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Pierre-Francois","family":"Calmon","sequence":"additional","affiliation":[{"name":"LAAS-CNRS,Toulouse,FRANCE"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Thierry","family":"Bosch","sequence":"additional","affiliation":[{"name":"LAAS-CNRS,Toulouse,FRANCE"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Olivier","family":"Bernal","sequence":"additional","affiliation":[{"name":"LAAS-CNRS,Toulouse,FRANCE"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1088\/1742-6596\/1249\/1\/012020"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1364\/OL.394143"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1364\/AO.53.000702"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2020.2970599"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1364\/PRJ.7.000201"},{"key":"ref15","first-page":"1","article-title":"High-yield, wafer-scale fabrication of ultralow-loss, dispersion-engineered silicon nitride photonic circuits","volume":"12","author":"liu","year":"2021","journal-title":"Nature Communications"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2021.3083643"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1364\/AO.51.005318"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2021.3112477"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1364\/OL.36.000822"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/LPT.2017.2735899"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JQE.1980.1070479"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1364\/AOP.7.000570"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1002\/lpor.201100002"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1364\/OL.40.002814"}],"event":{"name":"2022 IEEE Sensors","start":{"date-parts":[[2022,10,30]]},"location":"Dallas, TX, USA","end":{"date-parts":[[2022,11,2]]}},"container-title":["2022 IEEE Sensors"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9966996\/9966997\/09967153.pdf?arnumber=9967153","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,26]],"date-time":"2022-12-26T19:46:45Z","timestamp":1672084005000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9967153\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10,30]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/sensors52175.2022.9967153","relation":{},"subject":[],"published":{"date-parts":[[2022,10,30]]}}}