{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,4]],"date-time":"2026-06-04T15:19:43Z","timestamp":1780586383191,"version":"3.54.1"},"reference-count":19,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,10,30]],"date-time":"2022-10-30T00:00:00Z","timestamp":1667088000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,10,30]],"date-time":"2022-10-30T00:00:00Z","timestamp":1667088000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,10,30]]},"DOI":"10.1109\/sensors52175.2022.9967195","type":"proceedings-article","created":{"date-parts":[[2022,12,8]],"date-time":"2022-12-08T18:42:41Z","timestamp":1670524961000},"page":"1-4","source":"Crossref","is-referenced-by-count":6,"title":["An Approach for Smart and cost-Efficient Automated E-Waste Recycling for Small to medium-Sized Devices Using multi-Sensors"],"prefix":"10.1109","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-9683-5920","authenticated-orcid":false,"given":"Nermeen Abou","family":"Baker","sequence":"first","affiliation":[{"name":"Ruhr West university of applied sciences,Computer science department,Bottrop,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1230-9446","authenticated-orcid":false,"given":"Uwe","family":"Handmann","sequence":"additional","affiliation":[{"name":"Ruhr West university of applied sciences,Computer science department,Bottrop,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1007\/s10163-005-0144-3"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.minpro.2015.09.013"},{"key":"ref12","article-title":"Transfer learning-based method for automated e-waste recycling in smart cities","volume":"5","author":"baker","year":"2021","journal-title":"EAI Endorsed Transactions on Smart Cities"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.3390\/make4010002"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.procir.2020.01.110"},{"key":"ref15","first-page":"656","article-title":"Pre-analysis of printed circuit boards based on multispectral imaging for vision based recognition of electronics waste","volume":"9","author":"kleber","year":"2015","journal-title":"World Academy of Science Engineering and Technology International Journal of Computer Electrical Automation Control and Information Engineering"},{"key":"ref16","article-title":"Efficientnet: Rethinking model scaling for convolutional neural networks","volume":"abs 1905 11946","author":"tan","year":"2019","journal-title":"CoRR"},{"key":"ref17","article-title":"Inverted residuals and linear bottlenecks: Mobile networks for classification, detection and segmentation","author":"howard","year":"2018","journal-title":"CVPR"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2018.00745"},{"key":"ref19","author":"ramachandran","year":"2017","journal-title":"Searching for Activation Function"},{"key":"ref4","doi-asserted-by":"crossref","DOI":"10.3390\/resources10040028","article-title":"Artificial intelligence in the sorting of municipal waste as an enabler of the circular economy","volume":"10","author":"wilts","year":"2021","journal-title":"Resources"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/FENDT.2017.8584610"},{"key":"ref6","first-page":"138","article-title":"Active thermographic structural feature inspection of wind-turbine rotor blades","author":"fey","year":"2017","journal-title":"IEEE Far East Nondestructive Testing (FENT 2017)"},{"key":"ref5","year":"0","journal-title":"Fujitsu Laboratories of Europe howpublished"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-76063-2_29"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.3390\/su131810357"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/SusTech.2018.8671329"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.3390\/s120810326"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISEE.2005.1437004"}],"event":{"name":"2022 IEEE Sensors","location":"Dallas, TX, USA","start":{"date-parts":[[2022,10,30]]},"end":{"date-parts":[[2022,11,2]]}},"container-title":["2022 IEEE Sensors"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9966996\/9966997\/09967195.pdf?arnumber=9967195","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,26]],"date-time":"2022-12-26T19:46:16Z","timestamp":1672083976000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9967195\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10,30]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/sensors52175.2022.9967195","relation":{},"subject":[],"published":{"date-parts":[[2022,10,30]]}}}