{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,24]],"date-time":"2025-10-24T17:19:29Z","timestamp":1761326369952,"version":"build-2065373602"},"reference-count":23,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,29]],"date-time":"2023-10-29T00:00:00Z","timestamp":1698537600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,29]],"date-time":"2023-10-29T00:00:00Z","timestamp":1698537600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001700","name":"Ministry of Education, Culture, Sports, Science and Technology (MEXT)","doi-asserted-by":"publisher","award":["JPMXP1222UTI042"],"award-info":[{"award-number":["JPMXP1222UTI042"]}],"id":[{"id":"10.13039\/501100001700","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,29]]},"DOI":"10.1109\/sensors56945.2023.10324865","type":"proceedings-article","created":{"date-parts":[[2023,11,28]],"date-time":"2023-11-28T14:02:53Z","timestamp":1701180173000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["Stretchable Microscale Patterned Interconnects Formed on Micro-Corrugated Vertical Wavy Structured Substrate"],"prefix":"10.1109","author":[{"given":"Michitaka","family":"Yamamoto","sequence":"first","affiliation":[{"name":"Graduate School of Engineering, The University of Tokyo,Tokyo,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Seiichi","family":"Takamatsu","sequence":"additional","affiliation":[{"name":"Graduate School of Engineering, The University of Tokyo,Tokyo,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Toshihiro","family":"Itoh","sequence":"additional","affiliation":[{"name":"Graduate School of Engineering, The University of Tokyo,Tokyo,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1021\/acsnano.7b04898"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.cossms.2014.12.007"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1038\/srep07254"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2010.06.011"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.carbon.2019.08.018"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.200801218"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201102463"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/s00542-018-4234-2"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2007.897887"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1002\/adma.200306107"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1038\/s41598-018-26731-8"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2008.03.025"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.3390\/mi9100519"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1557\/mrs.2012.48"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/20\/7\/075036"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2004.825190"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1116\/1.1756879"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.physe.2004.06.032"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2009.2033723"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1073\/pnas.1907732116"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2013.07.012"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1002\/eng2.12143"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.3390\/mi13081210"}],"event":{"name":"2023 IEEE SENSORS","start":{"date-parts":[[2023,10,29]]},"location":"Vienna, Austria","end":{"date-parts":[[2023,11,1]]}},"container-title":["2023 IEEE SENSORS"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10324456\/10324848\/10324865.pdf?arnumber=10324865","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,24]],"date-time":"2025-10-24T17:14:33Z","timestamp":1761326073000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10324865\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,29]]},"references-count":23,"URL":"https:\/\/doi.org\/10.1109\/sensors56945.2023.10324865","relation":{},"subject":[],"published":{"date-parts":[[2023,10,29]]}}}