{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,4]],"date-time":"2026-06-04T08:58:29Z","timestamp":1780563509390,"version":"3.54.1"},"reference-count":17,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,29]],"date-time":"2023-10-29T00:00:00Z","timestamp":1698537600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,29]],"date-time":"2023-10-29T00:00:00Z","timestamp":1698537600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,29]]},"DOI":"10.1109\/sensors56945.2023.10325273","type":"proceedings-article","created":{"date-parts":[[2023,11,28]],"date-time":"2023-11-28T14:02:53Z","timestamp":1701180173000},"page":"1-4","source":"Crossref","is-referenced-by-count":3,"title":["A Highly Sensitive Immunosensor for White Spot Syndrome Virus (WSSV) Envelope Protein VP28 Detection Based on Electrochemical Impedance Spectroscopy Technique"],"prefix":"10.1109","author":[{"given":"Linh Huynh Thi","family":"Thuy","sequence":"first","affiliation":[{"name":"School of Engineering and Technology, Hue University,Vietnam"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Phu Nguyen","family":"Dang","sequence":"additional","affiliation":[{"name":"University of Engineering and Technology, Vietnam National University,Hanoi,Vietnam"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hung","family":"Cao","sequence":"additional","affiliation":[{"name":"University of California,Irvine,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hung Anh","family":"Nguyen","sequence":"additional","affiliation":[{"name":"University of California,Irvine,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jung-Chih","family":"Chiao","sequence":"additional","affiliation":[{"name":"Southern Methodist University,Department of Electrical and Computer Engineering,Dallas,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chun-Ping","family":"Jen","sequence":"additional","affiliation":[{"name":"National Chung Cheng University,Department of Mechanical Engineering,Chia-Yi,Taiwan, ROC"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Loc Do","family":"Quang","sequence":"additional","affiliation":[{"name":"University of Science, Vietnam National University,Hanoi,Vietnam"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Trinh Chu","family":"Duc","sequence":"additional","affiliation":[{"name":"University of Engineering and Technology, Vietnam National University,Hanoi,Vietnam"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tung Thanh","family":"Bui","sequence":"additional","affiliation":[{"name":"University of Engineering and Technology, Vietnam National University,Hanoi,Vietnam"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1007\/s11705-012-1289-y"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1038\/srep46169"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.3354\/dao025133"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1046\/j.1365-2761.2001.00286.x"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1088\/0957-0233\/15\/2\/R01"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/s00216-003-2111-y"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1007\/s00216-010-3904-4"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/s00216-010-3906-2"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.aca.2010.09.038"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.jviromet.2011.01.010"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1186\/s12951-020-00712-4"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1051\/vetres\/2010015"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.3390\/s21196578"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.3390\/s91209513"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/S1003-6326(15)63813-4"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/S0022-0728(00)00415-0"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.jelechem.2004.12.007"}],"event":{"name":"2023 IEEE SENSORS","location":"Vienna, Austria","start":{"date-parts":[[2023,10,29]]},"end":{"date-parts":[[2023,11,1]]}},"container-title":["2023 IEEE SENSORS"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10324456\/10324848\/10325273.pdf?arnumber=10325273","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,24]],"date-time":"2025-10-24T17:14:20Z","timestamp":1761326060000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10325273\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,29]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/sensors56945.2023.10325273","relation":{},"subject":[],"published":{"date-parts":[[2023,10,29]]}}}