{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T10:13:00Z","timestamp":1767262380225,"version":"3.37.3"},"reference-count":16,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,29]],"date-time":"2023-10-29T00:00:00Z","timestamp":1698537600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,29]],"date-time":"2023-10-29T00:00:00Z","timestamp":1698537600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2018YFE0194500"],"award-info":[{"award-number":["2018YFE0194500"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["31827803"],"award-info":[{"award-number":["31827803"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,29]]},"DOI":"10.1109\/sensors56945.2023.10325274","type":"proceedings-article","created":{"date-parts":[[2023,11,28]],"date-time":"2023-11-28T19:02:53Z","timestamp":1701198173000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["High Performance Bidirectional Thermal Gas Flow Sensor of (100) Silicon Single-Sided Fabrication by 45\u00b0-Tilted Dicing"],"prefix":"10.1109","author":[{"given":"Yan","family":"Zhang","sequence":"first","affiliation":[{"name":"Micro Nano Sensing (Hefei) Technology Co., Ltd.,Hefei,China"}]},{"given":"Dongcheng","family":"Xie","sequence":"additional","affiliation":[{"name":"Micro Nano Sensing (Hefei) Technology Co., Ltd.,Hefei,China"}]},{"given":"Yujie","family":"Yang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, University of Science and Technology of China,Hefei,China"}]},{"given":"Ruichen","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, University of Science and Technology of China,Hefei,China"}]},{"given":"Chong","family":"Xing","sequence":"additional","affiliation":[{"name":"School of Microelectronics, University of Science and Technology of China,Hefei,China"}]},{"given":"Feng","family":"Xue","sequence":"additional","affiliation":[{"name":"School of Microelectronics, University of Science and Technology of China,Hefei,China"}]},{"given":"Dongliang","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Microelectronics, University of Science and Technology of China,Hefei,China"}]},{"given":"Lei","family":"Xu","sequence":"additional","affiliation":[{"name":"Micro Nano Sensing (Hefei) Technology Co., Ltd.,Hefei,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/S0955-5986(97)00019-8"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.3390\/mi3030550"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2019.06.020"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JIOT.2014.2319296"},{"issue":"7","key":"ref5","first-page":"1517","volume":"20","author":"Yu","year":"2007","journal-title":"Modeling and design of a new type air mass flow sensor"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.3390\/s100706594"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.2017.7863576"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/tie.2021.3066945"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2023.3243067"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2019.2914271"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/jmems.2018.2883131"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/NEMS.2018.8557002"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.2019.8870671"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2011.2179014"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2017.2707558"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TRANSDUCERS.2017.7994073"}],"event":{"name":"2023 IEEE SENSORS","start":{"date-parts":[[2023,10,29]]},"location":"Vienna, Austria","end":{"date-parts":[[2023,11,1]]}},"container-title":["2023 IEEE SENSORS"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10324456\/10324848\/10325274.pdf?arnumber=10325274","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,7,30]],"date-time":"2024-07-30T17:31:15Z","timestamp":1722360675000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10325274\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,29]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/sensors56945.2023.10325274","relation":{},"subject":[],"published":{"date-parts":[[2023,10,29]]}}}