{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,27]],"date-time":"2026-05-27T18:19:55Z","timestamp":1779905995230,"version":"3.53.1"},"reference-count":21,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,10,20]],"date-time":"2024-10-20T00:00:00Z","timestamp":1729382400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,20]],"date-time":"2024-10-20T00:00:00Z","timestamp":1729382400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,10,20]]},"DOI":"10.1109\/sensors60989.2024.10784539","type":"proceedings-article","created":{"date-parts":[[2024,12,17]],"date-time":"2024-12-17T19:07:24Z","timestamp":1734462444000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["YOLO-ICP: Deep Learning Integrated Pose Estimation for Bin-Picking of Multiple Objects"],"prefix":"10.1109","author":[{"given":"Huajian","family":"Li","sequence":"first","affiliation":[{"name":"Cognitive Material Diagnostics, Fraunhofer IKTS,Cottbus,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ivan","family":"Kraljevski","sequence":"additional","affiliation":[{"name":"Cognitive Material Diagnostics, Fraunhofer IKTS,Cottbus,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Paul","family":"Meyer","sequence":"additional","affiliation":[{"name":"Machine Learning and Data Analysis, Fraunhofer IKTS,Dresden,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Constanze","family":"Tsch\u00f6pe","sequence":"additional","affiliation":[{"name":"Cognitive Material Diagnostics, Fraunhofer IKTS,Cottbus,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Matthias","family":"Wolff","sequence":"additional","affiliation":[{"name":"Chair of Communications Engineering, BTU Cottbus-Senftenberg,Cottbus,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1007\/s10462-020-09888-5"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.cviu.2006.10.012"},{"issue":"5","key":"ref3","first-page":"1147Gl163","article-title":"Aver-satileandaccuratemonocularslamsystem","volume":"31","author":"MURGARTAL","year":"2015","journal-title":"IEEETransactionsonRobotics"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-37331-2_42"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.15607\/rss.2014.x.030"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICRA.2017.7989165"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.15607\/rss.2018.xiv.019"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICCV.2017.413"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2018.00038"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2016.91"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.3390\/make5040083"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICRA.2011.5980567"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/34.121791"},{"key":"ref14","article-title":"Efficient variants of the icp algorithm. 3d digital imaging and modeling","volume-title":"International Conference on","volume":"145","author":"Levoy","year":"2001"},{"key":"ref15","author":"Zhou","year":"2018","journal-title":"Open3d: A modern library for 3d data processing"},{"key":"ref16","volume-title":"6D Object Pose Estimation using 3D Object Coordinates [Data]","author":"Brachmann","year":"2020"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-10602-1_48"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/IWSSIP48289.2020.9145130"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2016.366"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ICCV.2017.169"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2019.00469"}],"event":{"name":"2024 IEEE SENSORS","location":"Kobe, Japan","start":{"date-parts":[[2024,10,20]]},"end":{"date-parts":[[2024,10,23]]}},"container-title":["2024 IEEE SENSORS"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10783834\/10784457\/10784539.pdf?arnumber=10784539","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,18]],"date-time":"2025-01-18T06:14:18Z","timestamp":1737180858000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10784539\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,20]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/sensors60989.2024.10784539","relation":{},"subject":[],"published":{"date-parts":[[2024,10,20]]}}}