{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,22]],"date-time":"2025-05-22T06:26:34Z","timestamp":1747895194589,"version":"3.33.0"},"reference-count":18,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,10,20]],"date-time":"2024-10-20T00:00:00Z","timestamp":1729382400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,20]],"date-time":"2024-10-20T00:00:00Z","timestamp":1729382400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,10,20]]},"DOI":"10.1109\/sensors60989.2024.10784631","type":"proceedings-article","created":{"date-parts":[[2024,12,17]],"date-time":"2024-12-17T19:07:24Z","timestamp":1734462444000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["Flexible Stretch-Free, Liquid-Sealed Packaging Method for Ultra-Thin Silicon-Based Bending Sensor"],"prefix":"10.1109","author":[{"given":"Hao","family":"Liu","sequence":"first","affiliation":[{"name":"The University of Tokyo,Department of Precision Engineering,JAPAN"}]},{"given":"Michitaka","family":"Yamamoto","sequence":"additional","affiliation":[{"name":"The University of Tokyo,Department of Precision Engineering,JAPAN"}]},{"given":"Seiichi","family":"Takamatsu","sequence":"additional","affiliation":[{"name":"The University of Tokyo,Department of Precision Engineering,JAPAN"}]},{"given":"Toshihiro","family":"Itoh","sequence":"additional","affiliation":[{"name":"The University of Tokyo,Department of Precision Engineering,JAPAN"}]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1002\/adfm.201804721"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1088\/0957-4484\/27\/37\/375501"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1021\/acsami.6b12991"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1038\/nnano.2015.324"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1016\/j.nanoen.2018.10.049"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1016\/j.nanoen.2021.106330"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1038\/nmat2896"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1016\/j.snb.2014.05.063"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.1039\/D0MH00483A"},{"doi-asserted-by":"publisher","key":"ref10","DOI":"10.1002\/advs.202202980"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1109\/ROBIO58561.2023.10355007"},{"doi-asserted-by":"publisher","key":"ref12","DOI":"10.1002\/adma.202304048"},{"doi-asserted-by":"publisher","key":"ref13","DOI":"10.1002\/admt.202301415"},{"doi-asserted-by":"publisher","key":"ref14","DOI":"10.1109\/TII.2023.3254662"},{"doi-asserted-by":"publisher","key":"ref15","DOI":"10.1126\/sciadv.abl6228"},{"doi-asserted-by":"publisher","key":"ref16","DOI":"10.7567\/JJAP.54.10ND08"},{"doi-asserted-by":"publisher","key":"ref17","DOI":"10.1038\/s41598-019-39364-2"},{"doi-asserted-by":"publisher","key":"ref18","DOI":"10.1109\/JSEN.2016.2578936"}],"event":{"name":"2024 IEEE SENSORS","start":{"date-parts":[[2024,10,20]]},"location":"Kobe, Japan","end":{"date-parts":[[2024,10,23]]}},"container-title":["2024 IEEE SENSORS"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10783834\/10784457\/10784631.pdf?arnumber=10784631","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,14]],"date-time":"2025-01-14T19:36:42Z","timestamp":1736883402000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10784631\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,20]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/sensors60989.2024.10784631","relation":{},"subject":[],"published":{"date-parts":[[2024,10,20]]}}}