{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,12,18]],"date-time":"2024-12-18T09:10:10Z","timestamp":1734513010412,"version":"3.30.2"},"reference-count":24,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,10,20]],"date-time":"2024-10-20T00:00:00Z","timestamp":1729382400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,20]],"date-time":"2024-10-20T00:00:00Z","timestamp":1729382400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,10,20]]},"DOI":"10.1109\/sensors60989.2024.10785155","type":"proceedings-article","created":{"date-parts":[[2024,12,17]],"date-time":"2024-12-17T19:07:24Z","timestamp":1734462444000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Wireless Readout System for Pressure Monitoring Using FFF-Printed Mold Fabricated Flexible Piezoresistive Sensors"],"prefix":"10.1109","author":[{"given":"Sai","family":"Peng","sequence":"first","affiliation":[{"name":"Mechatronics Group (M-Group),Department of Computer Science,KU Leuven, Bruges Campus,Belgium"}]},{"given":"Arthur","family":"Camelbeke","sequence":"additional","affiliation":[{"name":"Master of Industrial Sciences: Electronics-ICT,KU Leuven,Bruges Campus,Belgium"}]},{"given":"Kevin","family":"Deschamps","sequence":"additional","affiliation":[{"name":"Department of Rehabilitation Sciences,KU Leuven,Bruges Campus,Belgium"}]},{"given":"Veerle","family":"Vandeginste","sequence":"additional","affiliation":[{"name":"Department of Materials Engineering,KU Leuven,Bruges Campus,Belgium"}]},{"given":"Hans","family":"Hallez","sequence":"additional","affiliation":[{"name":"Mechatronics Group (M-Group),Department of Computer Science,KU Leuven, Bruges Campus,Belgium"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2018.07.006"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1002\/adem.202100379"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/s00776-005-0898-4"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1002\/smll.202303095"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/jsen.2023.3299610"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.201504560"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1002\/admt.201800681"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/LSENS.2018.2887098"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2022.3144467"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2018.2885638"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1002\/smll.201601419"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1002\/aelm.202000871"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6439\/aaadf4"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.promfg.2019.06.089"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.3390\/polym13224022"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1088\/1757-899x\/227\/1\/012033"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1126\/science.1158877"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.compscitech.2020.108617"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1021\/acssuschemeng.1c05401"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1007\/s10854-017-6693-0"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1002\/admt.202101239"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.compositesb.2021.109079"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1039\/D3MH00718A"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1002\/adem.202201499"}],"event":{"name":"2024 IEEE SENSORS","start":{"date-parts":[[2024,10,20]]},"location":"Kobe, Japan","end":{"date-parts":[[2024,10,23]]}},"container-title":["2024 IEEE SENSORS"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10783834\/10784457\/10785155.pdf?arnumber=10785155","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,12,18]],"date-time":"2024-12-18T07:59:06Z","timestamp":1734508746000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10785155\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,20]]},"references-count":24,"URL":"https:\/\/doi.org\/10.1109\/sensors60989.2024.10785155","relation":{},"subject":[],"published":{"date-parts":[[2024,10,20]]}}}