{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,24]],"date-time":"2026-03-24T15:18:27Z","timestamp":1774365507450,"version":"3.50.1"},"reference-count":19,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,6,1]],"date-time":"2019-06-01T00:00:00Z","timestamp":1559347200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,6,1]],"date-time":"2019-06-01T00:00:00Z","timestamp":1559347200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,6,1]],"date-time":"2019-06-01T00:00:00Z","timestamp":1559347200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,6]]},"DOI":"10.1109\/slip.2019.8771326","type":"proceedings-article","created":{"date-parts":[[2019,7,25]],"date-time":"2019-07-25T19:42:27Z","timestamp":1564083747000},"page":"1-6","source":"Crossref","is-referenced-by-count":6,"title":["Communication Considerations for Silicon Interconnect Fabric"],"prefix":"10.1109","author":[{"given":"Boris","family":"Vaisband","sequence":"first","affiliation":[]},{"given":"Subramanian S.","family":"Iyer","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2017.246"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2018.00197"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2002.1016885"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-29395-0"},{"key":"ref14","article-title":"From Homogeneous SoCs to Heterogeneous SoWs","author":"iyer","year":"2019","journal-title":"Proc Governm Microcircuit Applic & Critical Technol Conf (GomacTech)"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2374176"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ASSCC.2009.5357152"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ASSCC.2013.6691020"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/82.673643"},{"key":"ref19","first-page":"503","article-title":"Wire Sizing with Scattering Effect for Nanoscale Interconnection","author":"shian","year":"2006","journal-title":"Proceedings of the IEEE\/ACM Asia and South Pacific Design Automation Conference"},{"key":"ref4","article-title":"Orthogonal Scaling to Extend Computing to the ‘Cognitive’ Era","author":"iyer","year":"2014","journal-title":"Jack Kilby Lecture Government Microcircuit Applications & Critical Technology Conference (GOMACTech)"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.future.2018.04.092"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.7567\/JJAP.57.02BC03"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2018.00288"},{"key":"ref8","year":"0","journal-title":"Si-IF Design Manual"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2018.8357278"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2015.2511626"},{"key":"ref1","article-title":"3-D ICs as a Platform for Heterogeneous Systems Integration","author":"vaisband","year":"2017","journal-title":"Ph D thesis"},{"key":"ref9","article-title":"Integration and Characterization of InP Dies on Silicon Interconnect Fabric","author":"sorensen","year":"2019","journal-title":"Proc IEEE Electronic Components and Technology Conf"}],"event":{"name":"2019 ACM\/IEEE International Workshop on System Level Interconnect Prediction (SLIP)","location":"Las Vegas, NV, USA","start":{"date-parts":[[2019,6,1]]},"end":{"date-parts":[[2019,6,2]]}},"container-title":["2019 ACM\/IEEE International Workshop on System Level Interconnect Prediction (SLIP)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8766240\/8771325\/08771326.pdf?arnumber=8771326","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,19]],"date-time":"2022-07-19T16:18:54Z","timestamp":1658247534000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8771326\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,6]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/slip.2019.8771326","relation":{},"subject":[],"published":{"date-parts":[[2019,6]]}}}