{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,2]],"date-time":"2025-08-02T19:02:14Z","timestamp":1754161334602,"version":"3.41.2"},"reference-count":11,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,7]]},"DOI":"10.1109\/smacd.2019.8795260","type":"proceedings-article","created":{"date-parts":[[2019,8,15]],"date-time":"2019-08-15T19:22:56Z","timestamp":1565896976000},"page":"233-236","source":"Crossref","is-referenced-by-count":0,"title":["Charge-Based Model for Reliability Analysis Flow of Flip- Flops under Process Variation and Aging"],"prefix":"10.1109","author":[{"given":"Maike","family":"Taddiken","sequence":"first","affiliation":[{"name":"Institute of Electrodynamics and Microelectronics (ITEM.me), University of Bremen, Germany"}]},{"given":"Steffen","family":"Paul","sequence":"additional","affiliation":[{"name":"Institute of Electrodynamics and Microelectronics (ITEM.me), University of Bremen, Germany"}]},{"given":"Dagmar","family":"Peters-Drolshagen","sequence":"additional","affiliation":[{"name":"Institute of Electrodynamics and Microelectronics (ITEM.me), University of Bremen, Germany"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/SMACD.2018.8434902"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/SMACD.2017.7981618"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/SMACD.2017.7981581"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2013.07.044"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/SMACD.2018.8434847"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2016.12.012"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2018.2877594"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1049\/iet-cds.2013.0122"},{"journal-title":"Eldo UDRM User's Manual","year":"2017","author":"graphics","key":"ref2"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2012.03.024"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4614-6163-0"}],"event":{"name":"2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)","start":{"date-parts":[[2019,7,15]]},"location":"Lausanne, Switzerland","end":{"date-parts":[[2019,7,18]]}},"container-title":["2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8786808\/8795217\/08795260.pdf?arnumber=8795260","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,28]],"date-time":"2025-07-28T19:35:03Z","timestamp":1753731303000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8795260\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,7]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/smacd.2019.8795260","relation":{},"subject":[],"published":{"date-parts":[[2019,7]]}}}