{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,18]],"date-time":"2026-04-18T16:40:45Z","timestamp":1776530445699,"version":"3.51.2"},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,7]]},"DOI":"10.1109\/smacd.2019.8795296","type":"proceedings-article","created":{"date-parts":[[2019,8,15]],"date-time":"2019-08-15T19:22:56Z","timestamp":1565896976000},"page":"205-208","source":"Crossref","is-referenced-by-count":3,"title":["A new Method for the Analysis of Radiation-induced Effects in 3D VLSI Face-to-Back LUTs"],"prefix":"10.1109","author":[{"given":"Luca","family":"Sterpone","sequence":"first","affiliation":[{"name":"Politecnico di Torino, Torino, Italy"}]},{"given":"Ludovica","family":"Bozzoli","sequence":"additional","affiliation":[{"name":"Politecnico di Torino, Torino, Italy"}]},{"given":"Corrado","family":"De Sio","sequence":"additional","affiliation":[{"name":"Politecnico di Torino, Torino, Italy"}]},{"given":"Boyang","family":"Du","sequence":"additional","affiliation":[{"name":"Politecnico di Torino, Torino, Italy"}]},{"given":"Sarah","family":"Azimi","sequence":"additional","affiliation":[{"name":"Politecnico di Torino, Torino, Italy"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2012.6263022"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2010.2043686"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ASICON.2013.6812058"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/NSREC.2016.7891720"},{"key":"ref4","first-page":"24c","article-title":"Scalable 3D-FPGA using wafer-to-wafer TSV interconnect of 15 Tbps\/W, 3.3 Tbps\/mm2","author":"furuta","year":"2013","journal-title":"2013 Symposium on VLSI Circuits VLSIC"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2012.6242515"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2018.2801856"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/HPEC.2016.7761606"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.7873\/DATE2014.139"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2017.2777887"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.888266"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/5.929647"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2014.7152173"}],"event":{"name":"2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)","location":"Lausanne, Switzerland","start":{"date-parts":[[2019,7,15]]},"end":{"date-parts":[[2019,7,18]]}},"container-title":["2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8786808\/8795217\/08795296.pdf?arnumber=8795296","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,20]],"date-time":"2025-08-20T18:30:34Z","timestamp":1755714634000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8795296\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,7]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/smacd.2019.8795296","relation":{},"subject":[],"published":{"date-parts":[[2019,7]]}}}