{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T00:17:36Z","timestamp":1725409056272},"reference-count":0,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/socc.2004.1362385","type":"proceedings-article","created":{"date-parts":[[2004,12,23]],"date-time":"2004-12-23T04:34:02Z","timestamp":1103776442000},"page":"149-150","source":"Crossref","is-referenced-by-count":1,"title":["Bandgap yield loss due to dislocations on RFSiGe transceiver ICs: failure analysis, design improvements and process solutions"],"prefix":"10.1109","author":[{"given":"R.","family":"Oberhuber","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ch.","family":"Hechtl","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Y.","family":"Schimpf","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"B.","family":"Staufer","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","event":{"name":"IEEE International SOC Conference, 2004. Proceedings.","location":"Santa Clara, CA, USA"},"container-title":["IEEE International SOC Conference, 2004. Proceedings."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/9408\/29848\/01362385.pdf?arnumber=1362385","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,13]],"date-time":"2017-03-13T22:39:14Z","timestamp":1489444754000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1362385\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/socc.2004.1362385","relation":{},"subject":[]}}